|
Revision tags: v6.6.25, v6.6.24, v6.6.23, v6.6.16, v6.6.15, v6.6.14, v6.6.13, v6.6.12, v6.6.11, v6.6.10, v6.6.9, v6.6.8, v6.6.7, v6.6.6, v6.6.5, v6.6.4, v6.6.3, v6.6.2, v6.5.11, v6.6.1, v6.5.10, v6.6, v6.5.9, v6.5.8, v6.5.7, v6.5.6, v6.5.5, v6.5.4, v6.5.3, v6.5.2, v6.1.51, v6.5.1, v6.1.50, v6.5, v6.1.49, v6.1.48, v6.1.46, v6.1.45, v6.1.44, v6.1.43, v6.1.42, v6.1.41, v6.1.40, v6.1.39, v6.1.38, v6.1.37, v6.1.36, v6.4, v6.1.35, v6.1.34, v6.1.33 |
|
| #
ba3bcfeb |
| 07-Jun-2023 |
Stephan Gerhold <stephan.gerhold@kernkonzept.com> |
dt-bindings: thermal: qcom-tsens: Add MSM8909 compatible
MSM8909 uses the TSENS v0.1 block similar to other SoCs like MDM9607.
Document the "qcom,msm8909-tsens" compatible in the existing schema.
A
dt-bindings: thermal: qcom-tsens: Add MSM8909 compatible
MSM8909 uses the TSENS v0.1 block similar to other SoCs like MDM9607.
Document the "qcom,msm8909-tsens" compatible in the existing schema.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-5-5eb632235ba7@kernkonzept.com
show more ...
|
| #
a0602782 |
| 07-Jun-2023 |
Stephan Gerhold <stephan.gerhold@kernkonzept.com> |
dt-bindings: thermal: qcom-tsens: Drop redundant compatibles
Since the SoC compatibles must be followed by the IP version compatible
(e.g. compatible = "qcom,msm8916-tsens", "qcom,tsens-v0_1";) it i
dt-bindings: thermal: qcom-tsens: Drop redundant compatibles
Since the SoC compatibles must be followed by the IP version compatible
(e.g. compatible = "qcom,msm8916-tsens", "qcom,tsens-v0_1";) it is
redundant to list all the SoC compatibles again in the if statement.
It will already match the IP-version compatible.
The list has already become inconsistent since for example
"qcom,msm8939-tsens" is covered by the if statement but is not listed
there explicitly like the other SoCs.
Simplify this by dropping the redundant SoC compatibles. ipq8064 and
msm8960 are still needed because they do not have an IP-version
compatible.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-4-5eb632235ba7@kernkonzept.com
show more ...
|
| #
074ccf8d |
| 07-Jun-2023 |
Praveenkumar I <quic_ipkumar@quicinc.com> |
dt-bindings: thermal: tsens: Add ipq9574 compatible
Qualcomm IPQ9574 has tsens v2.3.1 block, which is similar to IPQ8074 tsens.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Sig
dt-bindings: thermal: tsens: Add ipq9574 compatible
Qualcomm IPQ9574 has tsens v2.3.1 block, which is similar to IPQ8074 tsens.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Praveenkumar I <quic_ipkumar@quicinc.com>
Signed-off-by: Varadarajan Narayanan <quic_varada@quicinc.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/ec9799504fe5a141e107bb78955d8d427f00553f.1686125196.git.quic_varada@quicinc.com
show more ...
|
|
Revision tags: v6.1.32, v6.1.31, v6.1.30, v6.1.29, v6.1.28 |
|
| #
065ab3ab |
| 07-May-2023 |
Matti Lehtimäki <matti.lehtimaki@gmail.com> |
dt-bindings: thermal: tsens: Add compatible for MSM8226
Qualcomm MSM8226 has tsens v0.1 block.
Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof
dt-bindings: thermal: tsens: Add compatible for MSM8226
Qualcomm MSM8226 has tsens v0.1 block.
Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Luca Weiss <luca@z3ntu.xyz>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230507201225.89694-3-matti.lehtimaki@gmail.com
show more ...
|
| #
0849027b |
| 16-May-2023 |
Konrad Dybcio <konrad.dybcio@linaro.org> |
dt-bindings: thermal: tsens: Add compatible for SM6375
The Qualcomm SM6375 platform has two instances of the tsens v2.8.0 block,
add a compatible for these instances.
Acked-by: Krzysztof Kozlowski
dt-bindings: thermal: tsens: Add compatible for SM6375
The Qualcomm SM6375 platform has two instances of the tsens v2.8.0 block,
add a compatible for these instances.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230516-topic-lost_tsens_bindings-v1-2-99715746ddb1@linaro.org
show more ...
|
| #
05570560 |
| 16-May-2023 |
Konrad Dybcio <konrad.dybcio@linaro.org> |
dt-bindings: thermal: tsens: Add QCM2290
Add the TSENS v2.x controller found on QCM2290.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Konrad Dybcio <konrad.dybcio@l
dt-bindings: thermal: tsens: Add QCM2290
Add the TSENS v2.x controller found on QCM2290.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230516-topic-lost_tsens_bindings-v1-1-99715746ddb1@linaro.org
show more ...
|
|
Revision tags: v6.1.27, v6.1.26, v6.3, v6.1.25 |
|
| #
2afa82d1 |
| 20-Apr-2023 |
Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> |
dt-bindings: thermal: qcom-tsens: Correct unit address
Match unit-address to first reg entry.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rob Herring <robh@kernel.
dt-bindings: thermal: qcom-tsens: Correct unit address
Match unit-address to first reg entry.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230420072429.36255-1-krzysztof.kozlowski@linaro.org
show more ...
|
|
Revision tags: v6.1.24, v6.1.23, v6.1.22, v6.1.21, v6.1.20, v6.1.19, v6.1.18, v6.1.17, v6.1.16, v6.1.15, v6.1.14, v6.1.13, v6.2, v6.1.12, v6.1.11, v6.1.10, v6.1.9, v6.1.8, v6.1.7, v6.1.6, v6.1.5, v6.0.19, v6.0.18, v6.1.4, v6.1.3, v6.0.17 |
|
| #
acd31b9f |
| 01-Jan-2023 |
Dmitry Baryshkov <dmitry.baryshkov@linaro.org> |
dt-bindings: thermal: tsens: add per-sensor cells for msm8974
The msm8974 platform uses two sets of calibration data, add a special
case to handle both of them.
Acked-by: Krzysztof Kozlowski <krzys
dt-bindings: thermal: tsens: add per-sensor cells for msm8974
The msm8974 platform uses two sets of calibration data, add a special
case to handle both of them.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-4-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
show more ...
|
| #
4f4292bf |
| 01-Jan-2023 |
Dmitry Baryshkov <dmitry.baryshkov@linaro.org> |
dt-bindings: thermal: tsens: support per-sensor calibration cells
Allow specifying the exact calibration mode and calibration data as nvmem
cells, rather than specifying just a single calibration da
dt-bindings: thermal: tsens: support per-sensor calibration cells
Allow specifying the exact calibration mode and calibration data as nvmem
cells, rather than specifying just a single calibration data blob.
Note, unlike the vendor kernel the calibration data uses hw_ids rather
than software sensor indices (to match actual tsens usage in
thermal zones).
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-3-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
show more ...
|
| #
8c142145 |
| 01-Jan-2023 |
Dmitry Baryshkov <dmitry.baryshkov@linaro.org> |
dt-bindings: thermal: tsens: add msm8956 compat
When adding support for msm8976 it was thought that msm8956 would reuse
the same compat. However checking the vendor kernel revealed that these
two pl
dt-bindings: thermal: tsens: add msm8956 compat
When adding support for msm8976 it was thought that msm8956 would reuse
the same compat. However checking the vendor kernel revealed that these
two platforms use different slope values for calculating the calibration
data.
Add new compatible for the tsens on msm8956 SoC.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-2-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
show more ...
|
|
Revision tags: v6.1.2, v6.0.16, v6.1.1, v6.0.15, v6.0.14, v6.0.13, v6.1, v6.0.12, v6.0.11, v6.0.10, v5.15.80 |
|
| #
4a9f2011 |
| 16-Nov-2022 |
Neil Armstrong <neil.armstrong@linaro.org> |
dt-bindings: thermal: qcom-tsens: Add compatible for sm8550
The Qualcomm SM8550 platform has three instances of the tsens block,
add a compatible for these instances.
Signed-off-by: Neil Armstrong
dt-bindings: thermal: qcom-tsens: Add compatible for sm8550
The Qualcomm SM8550 platform has three instances of the tsens block,
add a compatible for these instances.
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Link: https://lore.kernel.org/r/20221114-narmstrong-sm8550-upstream-tsens-v1-0-0e169822830f@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
show more ...
|
| #
fa17c413 |
| 16-Nov-2022 |
Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> |
dt-bindings: thermal: qcom-tsens: narrow interrupts for SC8280XP, SM6350 and SM8450
Narrow number of interrupts per variants: SC8280XP, SM6350 and SM8450.
The compatibles are already used and descri
dt-bindings: thermal: qcom-tsens: narrow interrupts for SC8280XP, SM6350 and SM8450
Narrow number of interrupts per variants: SC8280XP, SM6350 and SM8450.
The compatibles are already used and described. They only missed the
constraints of number of interrupts.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221116113140.69587-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
show more ...
|
|
Revision tags: v6.0.9, v5.15.79, v6.0.8, v5.15.78, v6.0.7, v5.15.77, v5.15.76, v6.0.6, v6.0.5, v5.15.75, v6.0.4, v6.0.3, v6.0.2, v5.15.74, v5.15.73, v6.0.1, v5.15.72, v6.0, v5.15.71, v5.15.70, v5.15.69, v5.15.68, v5.15.67, v5.15.66, v5.15.65, v5.15.64, v5.15.63, v5.15.62 |
|
| #
c6db32ec |
| 18-Aug-2022 |
Robert Marko <robimarko@gmail.com> |
dt-bindings: thermal: tsens: Add ipq8074 compatible
Qualcomm IPQ8074 has tsens v2.3.0 block, though unlike existing v2 IP it
only uses one IRQ, so tsens v2 compatible cannot be used as the fallback.
dt-bindings: thermal: tsens: Add ipq8074 compatible
Qualcomm IPQ8074 has tsens v2.3.0 block, though unlike existing v2 IP it
only uses one IRQ, so tsens v2 compatible cannot be used as the fallback.
We also have to make sure that correct interrupts are set according to
compatibles, so populate interrupt information per compatibles.
Signed-off-by: Robert Marko <robimarko@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220818220245.338396-1-robimarko@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
show more ...
|
| #
f0f4c3ad |
| 16-Oct-2022 |
Luca Weiss <luca@z3ntu.xyz> |
dt-bindings: thermal: tsens: Add sm8450 compatible
Document the tsens-v2 compatible for sm8450 SoC.
Signed-off-by: Luca Weiss <luca@z3ntu.xyz>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@
dt-bindings: thermal: tsens: Add sm8450 compatible
Document the tsens-v2 compatible for sm8450 SoC.
Signed-off-by: Luca Weiss <luca@z3ntu.xyz>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221016090035.565350-5-luca@z3ntu.xyz
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
show more ...
|
| #
47612a9f |
| 30-Nov-2022 |
Adam Skladowski <a39.skl@gmail.com> |
dt-bindings: thermal: tsens: Add SM6115 compatible
Document compatible for tsens on Qualcomm SM6115 platform
according to downstream dts it ship v2.4 of IP
Signed-off-by: Adam Skladowski <a39.skl@g
dt-bindings: thermal: tsens: Add SM6115 compatible
Document compatible for tsens on Qualcomm SM6115 platform
according to downstream dts it ship v2.4 of IP
Signed-off-by: Adam Skladowski <a39.skl@gmail.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221130200950.144618-3-a39.skl@gmail.com
Signed-off-by: Rob Herring <robh@kernel.org>
show more ...
|
|
Revision tags: v5.15.61, v5.15.60, v5.15.59, v5.19, v5.15.58, v5.15.57, v5.15.56, v5.15.55, v5.15.54, v5.15.53, v5.15.52, v5.15.51, v5.15.50, v5.15.49, v5.15.48, v5.15.47, v5.15.46, v5.15.45, v5.15.44, v5.15.43, v5.15.42, v5.18, v5.15.41, v5.15.40, v5.15.39, v5.15.38 |
|
| #
30988d3b |
| 03-May-2022 |
Bjorn Andersson <bjorn.andersson@linaro.org> |
dt-bindings: thermal: tsens: Add sc8280xp compatible
The Qualcomm SC8280XP platform has three instances of the tsens block,
add a compatible for these instances.
Acked-by: Krzysztof Kozlowski <krzy
dt-bindings: thermal: tsens: Add sc8280xp compatible
The Qualcomm SC8280XP platform has three instances of the tsens block,
add a compatible for these instances.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220503153436.960184-1-bjorn.andersson@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
show more ...
|
|
Revision tags: v5.15.37, v5.15.36, v5.15.35, v5.15.34, v5.15.33 |
|
| #
a63fa2b6 |
| 05-Apr-2022 |
Dmitry Baryshkov <dmitry.baryshkov@linaro.org> |
dt-bindings: thermal: qcom-tsens.yaml: add msm8960 compat string
Add compatibility string for the thermal sensors on MSM8960/APQ8064
platforms.
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@lin
dt-bindings: thermal: qcom-tsens.yaml: add msm8960 compat string
Add compatibility string for the thermal sensors on MSM8960/APQ8064
platforms.
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220406002648.393486-2-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
show more ...
|
|
Revision tags: v5.15.32, v5.15.31, v5.17, v5.15.30, v5.15.29, v5.15.28, v5.15.27, v5.15.26, v5.15.25, v5.15.24, v5.15.23, v5.15.22, v5.15.21, v5.15.20, v5.15.19, v5.15.18, v5.15.17, v5.4.173, v5.15.16, v5.15.15, v5.16, v5.15.10, v5.15.9, v5.15.8 |
|
| #
0bd17679 |
| 13-Dec-2021 |
Luca Weiss <luca.weiss@fairphone.com> |
dt-bindings: thermal: tsens: Add SM6350 compatible
Add devicetree compatible for tsens on SM6350 SoC.
Signed-off-by: Luca Weiss <luca.weiss@fairphone.com>
Acked-by: Konrad Dybcio <konrad.dybcio@som
dt-bindings: thermal: tsens: Add SM6350 compatible
Add devicetree compatible for tsens on SM6350 SoC.
Signed-off-by: Luca Weiss <luca.weiss@fairphone.com>
Acked-by: Konrad Dybcio <konrad.dybcio@somainline.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20211213082614.22651-6-luca.weiss@fairphone.com
show more ...
|
| #
e8ec6bb3 |
| 20-Feb-2022 |
Luca Weiss <luca@z3ntu.xyz> |
dt-bindings: thermal: tsens: Add msm8953 compatible
Document the compatible string for tsens found in msm8953.
Signed-off-by: Luca Weiss <luca@z3ntu.xyz>
Acked-by: Konrad Dybcio <konrad.dybcio@soma
dt-bindings: thermal: tsens: Add msm8953 compatible
Document the compatible string for tsens found in msm8953.
Signed-off-by: Luca Weiss <luca@z3ntu.xyz>
Acked-by: Konrad Dybcio <konrad.dybcio@somainline.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220220201909.445468-3-luca@z3ntu.xyz
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
show more ...
|
|
Revision tags: v5.15.7, v5.15.6, v5.15.5, v5.15.4, v5.15.3, v5.15.2, v5.15.1, v5.15, v5.14.14, v5.14.13, v5.14.12, v5.14.11, v5.14.10, v5.14.9, v5.14.8, v5.14.7, v5.14.6, v5.10.67, v5.10.66, v5.14.5, v5.14.4, v5.10.65, v5.14.3, v5.10.64, v5.14.2, v5.10.63, v5.14.1, v5.10.62, v5.14, v5.10.61, v5.10.60 |
|
| #
7c54b82b |
| 28-Jul-2021 |
Konrad Dybcio <konrad.dybcio@somainline.org> |
arm64: dts: qcom: sdm630: Add TSENS node
This will enable temperature reporting for various SoC
components.
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: AngeloGioacchino Del Regno <angelo
arm64: dts: qcom: sdm630: Add TSENS node
This will enable temperature reporting for various SoC
components.
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@somainline.org>
Signed-off-by: Konrad Dybcio <konrad.dybcio@somainline.org>
Link: https://lore.kernel.org/r/20210728222542.54269-15-konrad.dybcio@somainline.org
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
show more ...
|
|
Revision tags: v5.10.53, v5.10.52, v5.10.51, v5.10.50, v5.10.49, v5.13, v5.10.46, v5.10.43 |
|
| #
481bd297 |
| 08-Jun-2021 |
Bjorn Andersson <bjorn.andersson@linaro.org> |
dt-bindings: thermal: tsens: Add sc8180x compatible
The Qualcomm sc8180x platform has the usual tsens blocks, add compatible
for this.
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Ac
dt-bindings: thermal: tsens: Add sc8180x compatible
The Qualcomm sc8180x platform has the usual tsens blocks, add compatible
for this.
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Acked-by: Thara Gopinath <thara.gopinath@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210608201638.2136344-1-bjorn.andersson@linaro.org
show more ...
|
| #
972d6a7d |
| 15-Jun-2021 |
Rob Herring <robh@kernel.org> |
dt-bindings: Drop redundant minItems/maxItems
If a property has an 'items' list, then a 'minItems' or 'maxItems' with the
same size as the list is redundant and can be dropped. Note that is DT
schem
dt-bindings: Drop redundant minItems/maxItems
If a property has an 'items' list, then a 'minItems' or 'maxItems' with the
same size as the list is redundant and can be dropped. Note that is DT
schema specific behavior and not standard json-schema behavior. The tooling
will fixup the final schema adding any unspecified minItems/maxItems.
This condition is partially checked with the meta-schema already, but
only if both 'minItems' and 'maxItems' are equal to the 'items' length.
An improved meta-schema is pending.
Cc: Jens Axboe <axboe@kernel.dk>
Cc: Stephen Boyd <sboyd@kernel.org>
Cc: Herbert Xu <herbert@gondor.apana.org.au>
Cc: "David S. Miller" <davem@davemloft.net>
Cc: David Airlie <airlied@linux.ie>
Cc: Daniel Vetter <daniel@ffwll.ch>
Cc: Bartosz Golaszewski <bgolaszewski@baylibre.com>
Cc: Kamal Dasu <kdasu.kdev@gmail.com>
Cc: Lars-Peter Clausen <lars@metafoo.de>
Cc: Thomas Gleixner <tglx@linutronix.de>
Cc: Marc Zyngier <maz@kernel.org>
Cc: Joerg Roedel <joro@8bytes.org>
Cc: Mauro Carvalho Chehab <mchehab@kernel.org>
Cc: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Cc: Jakub Kicinski <kuba@kernel.org>
Cc: Wolfgang Grandegger <wg@grandegger.com>
Cc: Andrew Lunn <andrew@lunn.ch>
Cc: Vivien Didelot <vivien.didelot@gmail.com>
Cc: Vladimir Oltean <olteanv@gmail.com>
Cc: Bjorn Helgaas <bhelgaas@google.com>
Cc: Kishon Vijay Abraham I <kishon@ti.com>
Cc: Linus Walleij <linus.walleij@linaro.org>
Cc: "Uwe Kleine-König" <u.kleine-koenig@pengutronix.de>
Cc: Lee Jones <lee.jones@linaro.org>
Cc: Ohad Ben-Cohen <ohad@wizery.com>
Cc: Mathieu Poirier <mathieu.poirier@linaro.org>
Cc: Paul Walmsley <paul.walmsley@sifive.com>
Cc: Palmer Dabbelt <palmer@dabbelt.com>
Cc: Albert Ou <aou@eecs.berkeley.edu>
Cc: Alessandro Zummo <a.zummo@towertech.it>
Cc: Alexandre Belloni <alexandre.belloni@bootlin.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Wim Van Sebroeck <wim@linux-watchdog.org>
Cc: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Marc Kleine-Budde <mkl@pengutronix.de>
Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # for MMC
Acked-by: Jassi Brar <jassisinghbrar@gmail.com>
Acked-By: Vinod Koul <vkoul@kernel.org>
Reviewed-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Reviewed-by: Arnaud Pouliquen <arnaud.pouliquen@st.com>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Philipp Zabel <p.zabel@pengutronix.de>
Acked-by: Wolfram Sang <wsa@kernel.org> # for I2C
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Link: https://lore.kernel.org/r/20210615191543.1043414-1-robh@kernel.org
show more ...
|
|
Revision tags: v5.10.42, v5.10.41, v5.10.40, v5.10.39, v5.4.119, v5.10.36, v5.10.35 |
|
| #
c6e66f5c |
| 07-May-2021 |
Rajeshwari Ravindra Kamble <rkambl@codeaurora.org> |
dt-bindings: thermal: tsens: Add compatible string to TSENS binding for SC7280
Adding compatible string in TSENS dt-bindings for SC7280.
Signed-off-by: Rajeshwari Ravindra Kamble <rkambl@codeaurora
dt-bindings: thermal: tsens: Add compatible string to TSENS binding for SC7280
Adding compatible string in TSENS dt-bindings for SC7280.
Signed-off-by: Rajeshwari Ravindra Kamble <rkambl@codeaurora.org>
Reviewed-by: Matthias Kaehlcke <mka@chromium.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1620367641-23383-2-git-send-email-rkambl@codeaurora.org
show more ...
|
|
Revision tags: v5.10.34, v5.4.116, v5.10.33, v5.12, v5.10.32 |
|
| #
26b2f03d |
| 20-Apr-2021 |
Ansuel Smith <ansuelsmth@gmail.com> |
dt-bindings: thermal: tsens: Document ipq8064 bindings
Document the use of bindings used for msm8960 tsens based devices.
msm8960 use the same gcc regs and is set as a child of the qcom gcc.
Signed
dt-bindings: thermal: tsens: Document ipq8064 bindings
Document the use of bindings used for msm8960 tsens based devices.
msm8960 use the same gcc regs and is set as a child of the qcom gcc.
Signed-off-by: Ansuel Smith <ansuelsmth@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210420183343.2272-10-ansuelsmth@gmail.com
show more ...
|
|
Revision tags: v5.10.31, v5.10.30, v5.10.27, v5.10.26 |
|
| #
c0612265 |
| 24-Mar-2021 |
Robert Foss <robert.foss@linaro.org> |
dt-bindings: thermal: qcom-tsens: Add compatible for sm8350
Add tsens bindings for sm8350.
Signed-off-by: Robert Foss <robert.foss@linaro.org>
Reviewed-by: Vinod Koul <vkoul@kernel.org>
Acked-by: R
dt-bindings: thermal: qcom-tsens: Add compatible for sm8350
Add tsens bindings for sm8350.
Signed-off-by: Robert Foss <robert.foss@linaro.org>
Reviewed-by: Vinod Koul <vkoul@kernel.org>
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210324124308.1265626-1-robert.foss@linaro.org
show more ...
|