Searched hist:"17 c29873" (Results 1 – 4 of 4) sorted by relevance
| /openbmc/u-boot/configs/ |
| H A D | dra7xx_hs_evm_defconfig | 17c29873 Mon Jun 27 09:19:22 CDT 2016 Andreas Dannenberg <dannenberg@ti.com> arm: omap5: add U-Boot FIT signing and SPL image post-processing
Modify the SPL build procedure for AM57xx and DRA7xx high-security (HS)
device variants to create a secure u-boot_HS.img FIT blob that contains
U-Boot and DTB artifacts signed with a TI-specific process based on the
CONFIG_TI_SECURE_DEVICE config option and the externally-provided image
signing tool.
Also populate the corresponding FIT image post processing call to be
performed during SPL runtime.
Signed-off-by: Daniel Allred <d-allred@ti.com>
Signed-off-by: Andreas Dannenberg <dannenberg@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
|
| H A D | am57xx_hs_evm_defconfig | 17c29873 Mon Jun 27 09:19:22 CDT 2016 Andreas Dannenberg <dannenberg@ti.com> arm: omap5: add U-Boot FIT signing and SPL image post-processing
Modify the SPL build procedure for AM57xx and DRA7xx high-security (HS)
device variants to create a secure u-boot_HS.img FIT blob that contains
U-Boot and DTB artifacts signed with a TI-specific process based on the
CONFIG_TI_SECURE_DEVICE config option and the externally-provided image
signing tool.
Also populate the corresponding FIT image post processing call to be
performed during SPL runtime.
Signed-off-by: Daniel Allred <d-allred@ti.com>
Signed-off-by: Andreas Dannenberg <dannenberg@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
|
| /openbmc/u-boot/board/ti/am57xx/ |
| H A D | board.c | 17c29873 Mon Jun 27 09:19:22 CDT 2016 Andreas Dannenberg <dannenberg@ti.com> arm: omap5: add U-Boot FIT signing and SPL image post-processing
Modify the SPL build procedure for AM57xx and DRA7xx high-security (HS)
device variants to create a secure u-boot_HS.img FIT blob that contains
U-Boot and DTB artifacts signed with a TI-specific process based on the
CONFIG_TI_SECURE_DEVICE config option and the externally-provided image
signing tool.
Also populate the corresponding FIT image post processing call to be
performed during SPL runtime.
Signed-off-by: Daniel Allred <d-allred@ti.com>
Signed-off-by: Andreas Dannenberg <dannenberg@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
|
| /openbmc/u-boot/board/ti/dra7xx/ |
| H A D | evm.c | 17c29873 Mon Jun 27 09:19:22 CDT 2016 Andreas Dannenberg <dannenberg@ti.com> arm: omap5: add U-Boot FIT signing and SPL image post-processing
Modify the SPL build procedure for AM57xx and DRA7xx high-security (HS)
device variants to create a secure u-boot_HS.img FIT blob that contains
U-Boot and DTB artifacts signed with a TI-specific process based on the
CONFIG_TI_SECURE_DEVICE config option and the externally-provided image
signing tool.
Also populate the corresponding FIT image post processing call to be
performed during SPL runtime.
Signed-off-by: Daniel Allred <d-allred@ti.com>
Signed-off-by: Andreas Dannenberg <dannenberg@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
|