xref: /openbmc/linux/drivers/thermal/Kconfig (revision fb37409a)
1# SPDX-License-Identifier: GPL-2.0-only
2#
3# Generic thermal drivers configuration
4#
5
6menuconfig THERMAL
7	bool "Thermal drivers"
8	help
9	  Thermal drivers offer a generic mechanism for
10	  thermal management. Usually it's made up of one or more thermal
11	  zones and cooling devices.
12	  Each thermal zone contains its own temperature, trip points,
13	  and cooling devices.
14	  All platforms with ACPI or Open Firmware thermal support can use
15	  this driver.
16	  If you want this support, you should say Y here.
17
18if THERMAL
19
20config THERMAL_STATISTICS
21	bool "Thermal state transition statistics"
22	help
23	  Export thermal state transition statistics information through sysfs.
24
25	  If in doubt, say N.
26
27config THERMAL_EMERGENCY_POWEROFF_DELAY_MS
28	int "Emergency poweroff delay in milli-seconds"
29	default 0
30	help
31	  Thermal subsystem will issue a graceful shutdown when
32	  critical temperatures are reached using orderly_poweroff(). In
33	  case of failure of an orderly_poweroff(), the thermal emergency
34	  poweroff kicks in after a delay has elapsed and shuts down the system.
35	  This config is number of milliseconds to delay before emergency
36	  poweroff kicks in. Similarly to the critical trip point,
37	  the delay should be carefully profiled so as to give adequate
38	  time for orderly_poweroff() to finish on regular execution.
39	  If set to 0 emergency poweroff will not be supported.
40
41	  In doubt, leave as 0.
42
43config THERMAL_HWMON
44	bool
45	prompt "Expose thermal sensors as hwmon device"
46	depends on HWMON=y || HWMON=THERMAL
47	default y
48	help
49	  In case a sensor is registered with the thermal
50	  framework, this option will also register it
51	  as a hwmon. The sensor will then have the common
52	  hwmon sysfs interface.
53
54	  Say 'Y' here if you want all thermal sensors to
55	  have hwmon sysfs interface too.
56
57config THERMAL_OF
58	bool
59	prompt "APIs to parse thermal data out of device tree"
60	depends on OF
61	default y
62	help
63	  This options provides helpers to add the support to
64	  read and parse thermal data definitions out of the
65	  device tree blob.
66
67	  Say 'Y' here if you need to build thermal infrastructure
68	  based on device tree.
69
70config THERMAL_WRITABLE_TRIPS
71	bool "Enable writable trip points"
72	help
73	  This option allows the system integrator to choose whether
74	  trip temperatures can be changed from userspace. The
75	  writable trips need to be specified when setting up the
76	  thermal zone but the choice here takes precedence.
77
78	  Say 'Y' here if you would like to allow userspace tools to
79	  change trip temperatures.
80
81choice
82	prompt "Default Thermal governor"
83	default THERMAL_DEFAULT_GOV_STEP_WISE
84	help
85	  This option sets which thermal governor shall be loaded at
86	  startup. If in doubt, select 'step_wise'.
87
88config THERMAL_DEFAULT_GOV_STEP_WISE
89	bool "step_wise"
90	select THERMAL_GOV_STEP_WISE
91	help
92	  Use the step_wise governor as default. This throttles the
93	  devices one step at a time.
94
95config THERMAL_DEFAULT_GOV_FAIR_SHARE
96	bool "fair_share"
97	select THERMAL_GOV_FAIR_SHARE
98	help
99	  Use the fair_share governor as default. This throttles the
100	  devices based on their 'contribution' to a zone. The
101	  contribution should be provided through platform data.
102
103config THERMAL_DEFAULT_GOV_USER_SPACE
104	bool "user_space"
105	select THERMAL_GOV_USER_SPACE
106	help
107	  Select this if you want to let the user space manage the
108	  platform thermals.
109
110config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
111	bool "power_allocator"
112	depends on THERMAL_GOV_POWER_ALLOCATOR
113	help
114	  Select this if you want to control temperature based on
115	  system and device power allocation. This governor can only
116	  operate on cooling devices that implement the power API.
117
118endchoice
119
120config THERMAL_GOV_FAIR_SHARE
121	bool "Fair-share thermal governor"
122	help
123	  Enable this to manage platform thermals using fair-share governor.
124
125config THERMAL_GOV_STEP_WISE
126	bool "Step_wise thermal governor"
127	help
128	  Enable this to manage platform thermals using a simple linear
129	  governor.
130
131config THERMAL_GOV_BANG_BANG
132	bool "Bang Bang thermal governor"
133	default n
134	help
135	  Enable this to manage platform thermals using bang bang governor.
136
137	  Say 'Y' here if you want to use two point temperature regulation
138	  used for fans without throttling.  Some fan drivers depend on this
139	  governor to be enabled (e.g. acerhdf).
140
141config THERMAL_GOV_USER_SPACE
142	bool "User_space thermal governor"
143	help
144	  Enable this to let the user space manage the platform thermals.
145
146config THERMAL_GOV_POWER_ALLOCATOR
147	bool "Power allocator thermal governor"
148	depends on ENERGY_MODEL
149	help
150	  Enable this to manage platform thermals by dynamically
151	  allocating and limiting power to devices.
152
153config CPU_THERMAL
154	bool "Generic cpu cooling support"
155	depends on THERMAL_OF
156	help
157	  Enable the CPU cooling features. If the system has no active
158	  cooling device available, this option allows to use the CPU
159	  as a cooling device.
160
161if CPU_THERMAL
162
163config CPU_FREQ_THERMAL
164	bool "CPU frequency cooling device"
165	depends on CPU_FREQ
166	default y
167	help
168	  This implements the generic cpu cooling mechanism through frequency
169	  reduction. An ACPI version of this already exists
170	  (drivers/acpi/processor_thermal.c).
171	  This will be useful for platforms using the generic thermal interface
172	  and not the ACPI interface.
173
174config CPU_IDLE_THERMAL
175	bool "CPU idle cooling device"
176	depends on IDLE_INJECT
177	help
178	  This implements the CPU cooling mechanism through
179	  idle injection. This will throttle the CPU by injecting
180	  idle cycle.
181endif
182
183config CLOCK_THERMAL
184	bool "Generic clock cooling support"
185	depends on COMMON_CLK
186	depends on PM_OPP
187	help
188	  This entry implements the generic clock cooling mechanism through
189	  frequency clipping. Typically used to cool off co-processors. The
190	  device that is configured to use this cooling mechanism will be
191	  controlled to reduce clock frequency whenever temperature is high.
192
193config DEVFREQ_THERMAL
194	bool "Generic device cooling support"
195	depends on PM_DEVFREQ
196	depends on PM_OPP
197	help
198	  This implements the generic devfreq cooling mechanism through
199	  frequency reduction for devices using devfreq.
200
201	  This will throttle the device by limiting the maximum allowed DVFS
202	  frequency corresponding to the cooling level.
203
204	  In order to use the power extensions of the cooling device,
205	  devfreq should use the simple_ondemand governor.
206
207	  If you want this support, you should say Y here.
208
209config THERMAL_EMULATION
210	bool "Thermal emulation mode support"
211	help
212	  Enable this option to make a emul_temp sysfs node in thermal zone
213	  directory to support temperature emulation. With emulation sysfs node,
214	  user can manually input temperature and test the different trip
215	  threshold behaviour for simulation purpose.
216
217	  WARNING: Be careful while enabling this option on production systems,
218	  because userland can easily disable the thermal policy by simply
219	  flooding this sysfs node with low temperature values.
220
221config THERMAL_MMIO
222	tristate "Generic Thermal MMIO driver"
223	depends on OF || COMPILE_TEST
224	depends on HAS_IOMEM
225	help
226	  This option enables the generic thermal MMIO driver that will use
227	  memory-mapped reads to get the temperature.  Any HW/System that
228	  allows temperature reading by a single memory-mapped reading, be it
229	  register or shared memory, is a potential candidate to work with this
230	  driver.
231
232config HISI_THERMAL
233	tristate "Hisilicon thermal driver"
234	depends on ARCH_HISI || COMPILE_TEST
235	depends on HAS_IOMEM
236	depends on OF
237	default y
238	help
239	  Enable this to plug hisilicon's thermal sensor driver into the Linux
240	  thermal framework. cpufreq is used as the cooling device to throttle
241	  CPUs when the passive trip is crossed.
242
243config IMX_THERMAL
244	tristate "Temperature sensor driver for Freescale i.MX SoCs"
245	depends on ARCH_MXC || COMPILE_TEST
246	depends on NVMEM || !NVMEM
247	depends on MFD_SYSCON
248	depends on OF
249	help
250	  Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
251	  It supports one critical trip point and one passive trip point.  The
252	  cpufreq is used as the cooling device to throttle CPUs when the
253	  passive trip is crossed.
254
255config IMX_SC_THERMAL
256	tristate "Temperature sensor driver for NXP i.MX SoCs with System Controller"
257	depends on IMX_SCU
258	depends on OF
259	help
260	  Support for Temperature Monitor (TEMPMON) found on NXP i.MX SoCs with
261	  system controller inside, Linux kernel has to communicate with system
262	  controller via MU (message unit) IPC to get temperature from thermal
263	  sensor. It supports one critical trip point and one
264	  passive trip point for each thermal sensor.
265
266config IMX8MM_THERMAL
267	tristate "Temperature sensor driver for Freescale i.MX8MM SoC"
268	depends on ARCH_MXC || COMPILE_TEST
269	depends on OF
270	help
271	  Support for Thermal Monitoring Unit (TMU) found on Freescale i.MX8MM SoC.
272	  It supports one critical trip point and one passive trip point. The
273	  cpufreq is used as the cooling device to throttle CPUs when the passive
274	  trip is crossed.
275
276config K3_THERMAL
277	tristate "Texas Instruments K3 thermal support"
278	depends on ARCH_K3 || COMPILE_TEST
279	help
280	  If you say yes here you get thermal support for the Texas Instruments
281	  K3 SoC family. The current chip supported is:
282	  - AM654
283
284	  This includes temperature reading functionality.
285
286config MAX77620_THERMAL
287	tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
288	depends on MFD_MAX77620
289	depends on OF
290	help
291	  Support for die junction temperature warning alarm for Maxim
292	  Semiconductor PMIC MAX77620 device. Device generates two alarm
293	  interrupts when PMIC die temperature cross the threshold of
294	  120 degC and 140 degC.
295
296config QORIQ_THERMAL
297	tristate "QorIQ Thermal Monitoring Unit"
298	depends on THERMAL_OF && HAS_IOMEM
299	depends on PPC_E500MC || SOC_LS1021A || ARCH_LAYERSCAPE || (ARCH_MXC && ARM64) || COMPILE_TEST
300	select REGMAP_MMIO
301	help
302	  Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
303	  It supports one critical trip point and one passive trip point. The
304	  cpufreq is used as the cooling device to throttle CPUs when the
305	  passive trip is crossed.
306
307config SPEAR_THERMAL
308	tristate "SPEAr thermal sensor driver"
309	depends on PLAT_SPEAR || COMPILE_TEST
310	depends on HAS_IOMEM
311	depends on OF
312	help
313	  Enable this to plug the SPEAr thermal sensor driver into the Linux
314	  thermal framework.
315
316config SUN8I_THERMAL
317	tristate "Allwinner sun8i thermal driver"
318	depends on ARCH_SUNXI || COMPILE_TEST
319	depends on HAS_IOMEM
320	depends on NVMEM
321	depends on OF
322	depends on RESET_CONTROLLER
323	help
324	  Support for the sun8i thermal sensor driver into the Linux thermal
325	  framework.
326
327	  To compile this driver as a module, choose M here: the
328	  module will be called sun8i-thermal.
329
330config ROCKCHIP_THERMAL
331	tristate "Rockchip thermal driver"
332	depends on ARCH_ROCKCHIP || COMPILE_TEST
333	depends on RESET_CONTROLLER
334	depends on HAS_IOMEM
335	help
336	  Rockchip thermal driver provides support for Temperature sensor
337	  ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
338	  trip point. Cpufreq is used as the cooling device and will throttle
339	  CPUs when the Temperature crosses the passive trip point.
340
341config RCAR_THERMAL
342	tristate "Renesas R-Car thermal driver"
343	depends on ARCH_RENESAS || COMPILE_TEST
344	depends on HAS_IOMEM
345	help
346	  Enable this to plug the R-Car thermal sensor driver into the Linux
347	  thermal framework.
348
349config RCAR_GEN3_THERMAL
350	tristate "Renesas R-Car Gen3 thermal driver"
351	depends on ARCH_RENESAS || COMPILE_TEST
352	depends on HAS_IOMEM
353	depends on OF
354	help
355	  Enable this to plug the R-Car Gen3 thermal sensor driver into the Linux
356	  thermal framework.
357
358config KIRKWOOD_THERMAL
359	tristate "Temperature sensor on Marvell Kirkwood SoCs"
360	depends on MACH_KIRKWOOD || COMPILE_TEST
361	depends on HAS_IOMEM
362	depends on OF
363	help
364	  Support for the Kirkwood thermal sensor driver into the Linux thermal
365	  framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
366
367config DOVE_THERMAL
368	tristate "Temperature sensor on Marvell Dove SoCs"
369	depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
370	depends on HAS_IOMEM
371	depends on OF
372	help
373	  Support for the Dove thermal sensor driver in the Linux thermal
374	  framework.
375
376config DB8500_THERMAL
377	tristate "DB8500 thermal management"
378	depends on MFD_DB8500_PRCMU && OF
379	default y
380	help
381	  Adds DB8500 thermal management implementation according to the thermal
382	  management framework. A thermal zone with several trip points will be
383	  created. Cooling devices can be bound to the trip points to cool this
384	  thermal zone if trip points reached.
385
386config ARMADA_THERMAL
387	tristate "Marvell EBU Armada SoCs thermal management"
388	depends on ARCH_MVEBU || COMPILE_TEST
389	depends on HAS_IOMEM
390	depends on OF
391	help
392	  Enable this option if you want to have support for thermal management
393	  controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K).
394
395config DA9062_THERMAL
396	tristate "DA9062/DA9061 Dialog Semiconductor thermal driver"
397	depends on MFD_DA9062 || COMPILE_TEST
398	depends on OF
399	help
400	  Enable this for the Dialog Semiconductor thermal sensor driver.
401	  This will report PMIC junction over-temperature for one thermal trip
402	  zone.
403	  Compatible with the DA9062 and DA9061 PMICs.
404
405config MTK_THERMAL
406	tristate "Temperature sensor driver for mediatek SoCs"
407	depends on ARCH_MEDIATEK || COMPILE_TEST
408	depends on HAS_IOMEM
409	depends on NVMEM || NVMEM=n
410	depends on RESET_CONTROLLER
411	default y
412	help
413	  Enable this option if you want to have support for thermal management
414	  controller present in Mediatek SoCs
415
416config AMLOGIC_THERMAL
417	tristate "Amlogic Thermal Support"
418	default ARCH_MESON
419	depends on OF && ARCH_MESON
420	help
421	  If you say yes here you get support for Amlogic Thermal
422	  for G12 SoC Family.
423
424	  This driver can also be built as a module. If so, the module will
425	  be called amlogic_thermal.
426
427menu "Intel thermal drivers"
428depends on X86 || X86_INTEL_QUARK || COMPILE_TEST
429source "drivers/thermal/intel/Kconfig"
430endmenu
431
432menu "Broadcom thermal drivers"
433depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \
434		COMPILE_TEST
435source "drivers/thermal/broadcom/Kconfig"
436endmenu
437
438menu "Texas Instruments thermal drivers"
439depends on ARCH_HAS_BANDGAP || COMPILE_TEST
440depends on HAS_IOMEM
441source "drivers/thermal/ti-soc-thermal/Kconfig"
442endmenu
443
444menu "Samsung thermal drivers"
445depends on ARCH_EXYNOS || COMPILE_TEST
446source "drivers/thermal/samsung/Kconfig"
447endmenu
448
449menu "STMicroelectronics thermal drivers"
450depends on (ARCH_STI || ARCH_STM32) && OF
451source "drivers/thermal/st/Kconfig"
452endmenu
453
454config TANGO_THERMAL
455	tristate "Tango thermal management"
456	depends on ARCH_TANGO || COMPILE_TEST
457	help
458	  Enable the Tango thermal driver, which supports the primitive
459	  temperature sensor embedded in Tango chips since the SMP8758.
460	  This sensor only generates a 1-bit signal to indicate whether
461	  the die temperature exceeds a programmable threshold.
462
463source "drivers/thermal/tegra/Kconfig"
464
465config GENERIC_ADC_THERMAL
466	tristate "Generic ADC based thermal sensor"
467	depends on IIO
468	help
469	  This enabled a thermal sysfs driver for the temperature sensor
470	  which is connected to the General Purpose ADC. The ADC channel
471	  is read via IIO framework and the channel information is provided
472	  to this driver. This driver reports the temperature by reading ADC
473	  channel and converts it to temperature based on lookup table.
474
475menu "Qualcomm thermal drivers"
476depends on (ARCH_QCOM && OF) || COMPILE_TEST
477source "drivers/thermal/qcom/Kconfig"
478endmenu
479
480config ZX2967_THERMAL
481	tristate "Thermal sensors on zx2967 SoC"
482	depends on ARCH_ZX || COMPILE_TEST
483	help
484	  Enable the zx2967 thermal sensors driver, which supports
485	  the primitive temperature sensor embedded in zx2967 SoCs.
486	  This sensor generates the real time die temperature.
487
488config UNIPHIER_THERMAL
489	tristate "Socionext UniPhier thermal driver"
490	depends on ARCH_UNIPHIER || COMPILE_TEST
491	depends on THERMAL_OF && MFD_SYSCON
492	help
493	  Enable this to plug in UniPhier on-chip PVT thermal driver into the
494	  thermal framework. The driver supports CPU thermal zone temperature
495	  reporting and a couple of trip points.
496
497config SPRD_THERMAL
498	tristate "Temperature sensor on Spreadtrum SoCs"
499	depends on ARCH_SPRD || COMPILE_TEST
500	help
501	  Support for the Spreadtrum thermal sensor driver in the Linux thermal
502	  framework.
503endif
504