1# SPDX-License-Identifier: GPL-2.0-only 2# 3# Generic thermal sysfs drivers configuration 4# 5 6menuconfig THERMAL 7 bool "Generic Thermal sysfs driver" 8 help 9 Generic Thermal Sysfs driver offers a generic mechanism for 10 thermal management. Usually it's made up of one or more thermal 11 zone and cooling device. 12 Each thermal zone contains its own temperature, trip points, 13 cooling devices. 14 All platforms with ACPI thermal support can use this driver. 15 If you want this support, you should say Y here. 16 17if THERMAL 18 19config THERMAL_STATISTICS 20 bool "Thermal state transition statistics" 21 help 22 Export thermal state transition statistics information through sysfs. 23 24 If in doubt, say N. 25 26config THERMAL_EMERGENCY_POWEROFF_DELAY_MS 27 int "Emergency poweroff delay in milli-seconds" 28 default 0 29 help 30 Thermal subsystem will issue a graceful shutdown when 31 critical temperatures are reached using orderly_poweroff(). In 32 case of failure of an orderly_poweroff(), the thermal emergency 33 poweroff kicks in after a delay has elapsed and shuts down the system. 34 This config is number of milliseconds to delay before emergency 35 poweroff kicks in. Similarly to the critical trip point, 36 the delay should be carefully profiled so as to give adequate 37 time for orderly_poweroff() to finish on regular execution. 38 If set to 0 emergency poweroff will not be supported. 39 40 In doubt, leave as 0. 41 42config THERMAL_HWMON 43 bool 44 prompt "Expose thermal sensors as hwmon device" 45 depends on HWMON=y || HWMON=THERMAL 46 default y 47 help 48 In case a sensor is registered with the thermal 49 framework, this option will also register it 50 as a hwmon. The sensor will then have the common 51 hwmon sysfs interface. 52 53 Say 'Y' here if you want all thermal sensors to 54 have hwmon sysfs interface too. 55 56config THERMAL_OF 57 bool 58 prompt "APIs to parse thermal data out of device tree" 59 depends on OF 60 default y 61 help 62 This options provides helpers to add the support to 63 read and parse thermal data definitions out of the 64 device tree blob. 65 66 Say 'Y' here if you need to build thermal infrastructure 67 based on device tree. 68 69config THERMAL_WRITABLE_TRIPS 70 bool "Enable writable trip points" 71 help 72 This option allows the system integrator to choose whether 73 trip temperatures can be changed from userspace. The 74 writable trips need to be specified when setting up the 75 thermal zone but the choice here takes precedence. 76 77 Say 'Y' here if you would like to allow userspace tools to 78 change trip temperatures. 79 80choice 81 prompt "Default Thermal governor" 82 default THERMAL_DEFAULT_GOV_STEP_WISE 83 help 84 This option sets which thermal governor shall be loaded at 85 startup. If in doubt, select 'step_wise'. 86 87config THERMAL_DEFAULT_GOV_STEP_WISE 88 bool "step_wise" 89 select THERMAL_GOV_STEP_WISE 90 help 91 Use the step_wise governor as default. This throttles the 92 devices one step at a time. 93 94config THERMAL_DEFAULT_GOV_FAIR_SHARE 95 bool "fair_share" 96 select THERMAL_GOV_FAIR_SHARE 97 help 98 Use the fair_share governor as default. This throttles the 99 devices based on their 'contribution' to a zone. The 100 contribution should be provided through platform data. 101 102config THERMAL_DEFAULT_GOV_USER_SPACE 103 bool "user_space" 104 select THERMAL_GOV_USER_SPACE 105 help 106 Select this if you want to let the user space manage the 107 platform thermals. 108 109config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR 110 bool "power_allocator" 111 depends on THERMAL_GOV_POWER_ALLOCATOR 112 help 113 Select this if you want to control temperature based on 114 system and device power allocation. This governor can only 115 operate on cooling devices that implement the power API. 116 117endchoice 118 119config THERMAL_GOV_FAIR_SHARE 120 bool "Fair-share thermal governor" 121 help 122 Enable this to manage platform thermals using fair-share governor. 123 124config THERMAL_GOV_STEP_WISE 125 bool "Step_wise thermal governor" 126 help 127 Enable this to manage platform thermals using a simple linear 128 governor. 129 130config THERMAL_GOV_BANG_BANG 131 bool "Bang Bang thermal governor" 132 default n 133 help 134 Enable this to manage platform thermals using bang bang governor. 135 136 Say 'Y' here if you want to use two point temperature regulation 137 used for fans without throttling. Some fan drivers depend on this 138 governor to be enabled (e.g. acerhdf). 139 140config THERMAL_GOV_USER_SPACE 141 bool "User_space thermal governor" 142 help 143 Enable this to let the user space manage the platform thermals. 144 145config THERMAL_GOV_POWER_ALLOCATOR 146 bool "Power allocator thermal governor" 147 depends on ENERGY_MODEL 148 help 149 Enable this to manage platform thermals by dynamically 150 allocating and limiting power to devices. 151 152config CPU_THERMAL 153 bool "Generic cpu cooling support" 154 depends on THERMAL_OF 155 help 156 Enable the CPU cooling features. If the system has no active 157 cooling device available, this option allows to use the CPU 158 as a cooling device. 159 160if CPU_THERMAL 161 162config CPU_FREQ_THERMAL 163 bool "CPU frequency cooling device" 164 depends on CPU_FREQ 165 default y 166 help 167 This implements the generic cpu cooling mechanism through frequency 168 reduction. An ACPI version of this already exists 169 (drivers/acpi/processor_thermal.c). 170 This will be useful for platforms using the generic thermal interface 171 and not the ACPI interface. 172 173config CPU_IDLE_THERMAL 174 bool "CPU idle cooling device" 175 depends on IDLE_INJECT 176 help 177 This implements the CPU cooling mechanism through 178 idle injection. This will throttle the CPU by injecting 179 idle cycle. 180endif 181 182config CLOCK_THERMAL 183 bool "Generic clock cooling support" 184 depends on COMMON_CLK 185 depends on PM_OPP 186 help 187 This entry implements the generic clock cooling mechanism through 188 frequency clipping. Typically used to cool off co-processors. The 189 device that is configured to use this cooling mechanism will be 190 controlled to reduce clock frequency whenever temperature is high. 191 192config DEVFREQ_THERMAL 193 bool "Generic device cooling support" 194 depends on PM_DEVFREQ 195 depends on PM_OPP 196 help 197 This implements the generic devfreq cooling mechanism through 198 frequency reduction for devices using devfreq. 199 200 This will throttle the device by limiting the maximum allowed DVFS 201 frequency corresponding to the cooling level. 202 203 In order to use the power extensions of the cooling device, 204 devfreq should use the simple_ondemand governor. 205 206 If you want this support, you should say Y here. 207 208config THERMAL_EMULATION 209 bool "Thermal emulation mode support" 210 help 211 Enable this option to make a emul_temp sysfs node in thermal zone 212 directory to support temperature emulation. With emulation sysfs node, 213 user can manually input temperature and test the different trip 214 threshold behaviour for simulation purpose. 215 216 WARNING: Be careful while enabling this option on production systems, 217 because userland can easily disable the thermal policy by simply 218 flooding this sysfs node with low temperature values. 219 220config THERMAL_MMIO 221 tristate "Generic Thermal MMIO driver" 222 depends on OF || COMPILE_TEST 223 depends on HAS_IOMEM 224 help 225 This option enables the generic thermal MMIO driver that will use 226 memory-mapped reads to get the temperature. Any HW/System that 227 allows temperature reading by a single memory-mapped reading, be it 228 register or shared memory, is a potential candidate to work with this 229 driver. 230 231config HISI_THERMAL 232 tristate "Hisilicon thermal driver" 233 depends on ARCH_HISI || COMPILE_TEST 234 depends on HAS_IOMEM 235 depends on OF 236 default y 237 help 238 Enable this to plug hisilicon's thermal sensor driver into the Linux 239 thermal framework. cpufreq is used as the cooling device to throttle 240 CPUs when the passive trip is crossed. 241 242config IMX_THERMAL 243 tristate "Temperature sensor driver for Freescale i.MX SoCs" 244 depends on ARCH_MXC || COMPILE_TEST 245 depends on NVMEM || !NVMEM 246 depends on MFD_SYSCON 247 depends on OF 248 help 249 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs. 250 It supports one critical trip point and one passive trip point. The 251 cpufreq is used as the cooling device to throttle CPUs when the 252 passive trip is crossed. 253 254config MAX77620_THERMAL 255 tristate "Temperature sensor driver for Maxim MAX77620 PMIC" 256 depends on MFD_MAX77620 257 depends on OF 258 help 259 Support for die junction temperature warning alarm for Maxim 260 Semiconductor PMIC MAX77620 device. Device generates two alarm 261 interrupts when PMIC die temperature cross the threshold of 262 120 degC and 140 degC. 263 264config QORIQ_THERMAL 265 tristate "QorIQ Thermal Monitoring Unit" 266 depends on THERMAL_OF 267 depends on HAS_IOMEM 268 help 269 Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms. 270 It supports one critical trip point and one passive trip point. The 271 cpufreq is used as the cooling device to throttle CPUs when the 272 passive trip is crossed. 273 274config SPEAR_THERMAL 275 tristate "SPEAr thermal sensor driver" 276 depends on PLAT_SPEAR || COMPILE_TEST 277 depends on HAS_IOMEM 278 depends on OF 279 help 280 Enable this to plug the SPEAr thermal sensor driver into the Linux 281 thermal framework. 282 283config SUN8I_THERMAL 284 tristate "Allwinner sun8i thermal driver" 285 depends on ARCH_SUNXI || COMPILE_TEST 286 depends on HAS_IOMEM 287 depends on NVMEM 288 depends on OF 289 depends on RESET_CONTROLLER 290 help 291 Support for the sun8i thermal sensor driver into the Linux thermal 292 framework. 293 294 To compile this driver as a module, choose M here: the 295 module will be called sun8i-thermal. 296 297config ROCKCHIP_THERMAL 298 tristate "Rockchip thermal driver" 299 depends on ARCH_ROCKCHIP || COMPILE_TEST 300 depends on RESET_CONTROLLER 301 depends on HAS_IOMEM 302 help 303 Rockchip thermal driver provides support for Temperature sensor 304 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical 305 trip point. Cpufreq is used as the cooling device and will throttle 306 CPUs when the Temperature crosses the passive trip point. 307 308config RCAR_THERMAL 309 tristate "Renesas R-Car thermal driver" 310 depends on ARCH_RENESAS || COMPILE_TEST 311 depends on HAS_IOMEM 312 help 313 Enable this to plug the R-Car thermal sensor driver into the Linux 314 thermal framework. 315 316config RCAR_GEN3_THERMAL 317 tristate "Renesas R-Car Gen3 thermal driver" 318 depends on ARCH_RENESAS || COMPILE_TEST 319 depends on HAS_IOMEM 320 depends on OF 321 help 322 Enable this to plug the R-Car Gen3 thermal sensor driver into the Linux 323 thermal framework. 324 325config KIRKWOOD_THERMAL 326 tristate "Temperature sensor on Marvell Kirkwood SoCs" 327 depends on MACH_KIRKWOOD || COMPILE_TEST 328 depends on HAS_IOMEM 329 depends on OF 330 help 331 Support for the Kirkwood thermal sensor driver into the Linux thermal 332 framework. Only kirkwood 88F6282 and 88F6283 have this sensor. 333 334config DOVE_THERMAL 335 tristate "Temperature sensor on Marvell Dove SoCs" 336 depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST 337 depends on HAS_IOMEM 338 depends on OF 339 help 340 Support for the Dove thermal sensor driver in the Linux thermal 341 framework. 342 343config DB8500_THERMAL 344 tristate "DB8500 thermal management" 345 depends on MFD_DB8500_PRCMU && OF 346 default y 347 help 348 Adds DB8500 thermal management implementation according to the thermal 349 management framework. A thermal zone with several trip points will be 350 created. Cooling devices can be bound to the trip points to cool this 351 thermal zone if trip points reached. 352 353config ARMADA_THERMAL 354 tristate "Marvell EBU Armada SoCs thermal management" 355 depends on ARCH_MVEBU || COMPILE_TEST 356 depends on HAS_IOMEM 357 depends on OF 358 help 359 Enable this option if you want to have support for thermal management 360 controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K). 361 362config DA9062_THERMAL 363 tristate "DA9062/DA9061 Dialog Semiconductor thermal driver" 364 depends on MFD_DA9062 || COMPILE_TEST 365 depends on OF 366 help 367 Enable this for the Dialog Semiconductor thermal sensor driver. 368 This will report PMIC junction over-temperature for one thermal trip 369 zone. 370 Compatible with the DA9062 and DA9061 PMICs. 371 372config MTK_THERMAL 373 tristate "Temperature sensor driver for mediatek SoCs" 374 depends on ARCH_MEDIATEK || COMPILE_TEST 375 depends on HAS_IOMEM 376 depends on NVMEM || NVMEM=n 377 depends on RESET_CONTROLLER 378 default y 379 help 380 Enable this option if you want to have support for thermal management 381 controller present in Mediatek SoCs 382 383config AMLOGIC_THERMAL 384 tristate "Amlogic Thermal Support" 385 default ARCH_MESON 386 depends on OF && ARCH_MESON 387 help 388 If you say yes here you get support for Amlogic Thermal 389 for G12 SoC Family. 390 391 This driver can also be built as a module. If so, the module will 392 be called amlogic_thermal. 393 394menu "Intel thermal drivers" 395depends on X86 || X86_INTEL_QUARK || COMPILE_TEST 396source "drivers/thermal/intel/Kconfig" 397endmenu 398 399menu "Broadcom thermal drivers" 400depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \ 401 COMPILE_TEST 402source "drivers/thermal/broadcom/Kconfig" 403endmenu 404 405menu "Texas Instruments thermal drivers" 406depends on ARCH_HAS_BANDGAP || COMPILE_TEST 407depends on HAS_IOMEM 408source "drivers/thermal/ti-soc-thermal/Kconfig" 409endmenu 410 411menu "Samsung thermal drivers" 412depends on ARCH_EXYNOS || COMPILE_TEST 413source "drivers/thermal/samsung/Kconfig" 414endmenu 415 416menu "STMicroelectronics thermal drivers" 417depends on (ARCH_STI || ARCH_STM32) && OF 418source "drivers/thermal/st/Kconfig" 419endmenu 420 421config TANGO_THERMAL 422 tristate "Tango thermal management" 423 depends on ARCH_TANGO || COMPILE_TEST 424 help 425 Enable the Tango thermal driver, which supports the primitive 426 temperature sensor embedded in Tango chips since the SMP8758. 427 This sensor only generates a 1-bit signal to indicate whether 428 the die temperature exceeds a programmable threshold. 429 430source "drivers/thermal/tegra/Kconfig" 431 432config GENERIC_ADC_THERMAL 433 tristate "Generic ADC based thermal sensor" 434 depends on IIO 435 help 436 This enabled a thermal sysfs driver for the temperature sensor 437 which is connected to the General Purpose ADC. The ADC channel 438 is read via IIO framework and the channel information is provided 439 to this driver. This driver reports the temperature by reading ADC 440 channel and converts it to temperature based on lookup table. 441 442menu "Qualcomm thermal drivers" 443depends on (ARCH_QCOM && OF) || COMPILE_TEST 444source "drivers/thermal/qcom/Kconfig" 445endmenu 446 447config ZX2967_THERMAL 448 tristate "Thermal sensors on zx2967 SoC" 449 depends on ARCH_ZX || COMPILE_TEST 450 help 451 Enable the zx2967 thermal sensors driver, which supports 452 the primitive temperature sensor embedded in zx2967 SoCs. 453 This sensor generates the real time die temperature. 454 455config UNIPHIER_THERMAL 456 tristate "Socionext UniPhier thermal driver" 457 depends on ARCH_UNIPHIER || COMPILE_TEST 458 depends on THERMAL_OF && MFD_SYSCON 459 help 460 Enable this to plug in UniPhier on-chip PVT thermal driver into the 461 thermal framework. The driver supports CPU thermal zone temperature 462 reporting and a couple of trip points. 463endif 464