1# 2# Generic thermal sysfs drivers configuration 3# 4 5menuconfig THERMAL 6 tristate "Generic Thermal sysfs driver" 7 help 8 Generic Thermal Sysfs driver offers a generic mechanism for 9 thermal management. Usually it's made up of one or more thermal 10 zone and cooling device. 11 Each thermal zone contains its own temperature, trip points, 12 cooling devices. 13 All platforms with ACPI thermal support can use this driver. 14 If you want this support, you should say Y or M here. 15 16if THERMAL 17 18config THERMAL_HWMON 19 bool 20 prompt "Expose thermal sensors as hwmon device" 21 depends on HWMON=y || HWMON=THERMAL 22 default y 23 help 24 In case a sensor is registered with the thermal 25 framework, this option will also register it 26 as a hwmon. The sensor will then have the common 27 hwmon sysfs interface. 28 29 Say 'Y' here if you want all thermal sensors to 30 have hwmon sysfs interface too. 31 32config THERMAL_OF 33 bool 34 prompt "APIs to parse thermal data out of device tree" 35 depends on OF 36 default y 37 help 38 This options provides helpers to add the support to 39 read and parse thermal data definitions out of the 40 device tree blob. 41 42 Say 'Y' here if you need to build thermal infrastructure 43 based on device tree. 44 45config THERMAL_WRITABLE_TRIPS 46 bool "Enable writable trip points" 47 help 48 This option allows the system integrator to choose whether 49 trip temperatures can be changed from userspace. The 50 writable trips need to be specified when setting up the 51 thermal zone but the choice here takes precedence. 52 53 Say 'Y' here if you would like to allow userspace tools to 54 change trip temperatures. 55 56choice 57 prompt "Default Thermal governor" 58 default THERMAL_DEFAULT_GOV_STEP_WISE 59 help 60 This option sets which thermal governor shall be loaded at 61 startup. If in doubt, select 'step_wise'. 62 63config THERMAL_DEFAULT_GOV_STEP_WISE 64 bool "step_wise" 65 select THERMAL_GOV_STEP_WISE 66 help 67 Use the step_wise governor as default. This throttles the 68 devices one step at a time. 69 70config THERMAL_DEFAULT_GOV_FAIR_SHARE 71 bool "fair_share" 72 select THERMAL_GOV_FAIR_SHARE 73 help 74 Use the fair_share governor as default. This throttles the 75 devices based on their 'contribution' to a zone. The 76 contribution should be provided through platform data. 77 78config THERMAL_DEFAULT_GOV_USER_SPACE 79 bool "user_space" 80 select THERMAL_GOV_USER_SPACE 81 help 82 Select this if you want to let the user space manage the 83 platform thermals. 84 85config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR 86 bool "power_allocator" 87 select THERMAL_GOV_POWER_ALLOCATOR 88 help 89 Select this if you want to control temperature based on 90 system and device power allocation. This governor can only 91 operate on cooling devices that implement the power API. 92 93endchoice 94 95config THERMAL_GOV_FAIR_SHARE 96 bool "Fair-share thermal governor" 97 help 98 Enable this to manage platform thermals using fair-share governor. 99 100config THERMAL_GOV_STEP_WISE 101 bool "Step_wise thermal governor" 102 help 103 Enable this to manage platform thermals using a simple linear 104 governor. 105 106config THERMAL_GOV_BANG_BANG 107 bool "Bang Bang thermal governor" 108 default n 109 help 110 Enable this to manage platform thermals using bang bang governor. 111 112 Say 'Y' here if you want to use two point temperature regulation 113 used for fans without throttling. Some fan drivers depend on this 114 governor to be enabled (e.g. acerhdf). 115 116config THERMAL_GOV_USER_SPACE 117 bool "User_space thermal governor" 118 help 119 Enable this to let the user space manage the platform thermals. 120 121config THERMAL_GOV_POWER_ALLOCATOR 122 bool "Power allocator thermal governor" 123 help 124 Enable this to manage platform thermals by dynamically 125 allocating and limiting power to devices. 126 127config CPU_THERMAL 128 bool "generic cpu cooling support" 129 depends on CPU_FREQ 130 depends on THERMAL_OF 131 help 132 This implements the generic cpu cooling mechanism through frequency 133 reduction. An ACPI version of this already exists 134 (drivers/acpi/processor_thermal.c). 135 This will be useful for platforms using the generic thermal interface 136 and not the ACPI interface. 137 138 If you want this support, you should say Y here. 139 140config CLOCK_THERMAL 141 bool "Generic clock cooling support" 142 depends on COMMON_CLK 143 depends on PM_OPP 144 help 145 This entry implements the generic clock cooling mechanism through 146 frequency clipping. Typically used to cool off co-processors. The 147 device that is configured to use this cooling mechanism will be 148 controlled to reduce clock frequency whenever temperature is high. 149 150config DEVFREQ_THERMAL 151 bool "Generic device cooling support" 152 depends on PM_DEVFREQ 153 depends on PM_OPP 154 help 155 This implements the generic devfreq cooling mechanism through 156 frequency reduction for devices using devfreq. 157 158 This will throttle the device by limiting the maximum allowed DVFS 159 frequency corresponding to the cooling level. 160 161 In order to use the power extensions of the cooling device, 162 devfreq should use the simple_ondemand governor. 163 164 If you want this support, you should say Y here. 165 166config THERMAL_EMULATION 167 bool "Thermal emulation mode support" 168 help 169 Enable this option to make a emul_temp sysfs node in thermal zone 170 directory to support temperature emulation. With emulation sysfs node, 171 user can manually input temperature and test the different trip 172 threshold behaviour for simulation purpose. 173 174 WARNING: Be careful while enabling this option on production systems, 175 because userland can easily disable the thermal policy by simply 176 flooding this sysfs node with low temperature values. 177 178config HISI_THERMAL 179 tristate "Hisilicon thermal driver" 180 depends on (ARCH_HISI && CPU_THERMAL && OF) || COMPILE_TEST 181 help 182 Enable this to plug hisilicon's thermal sensor driver into the Linux 183 thermal framework. cpufreq is used as the cooling device to throttle 184 CPUs when the passive trip is crossed. 185 186config IMX_THERMAL 187 tristate "Temperature sensor driver for Freescale i.MX SoCs" 188 depends on CPU_THERMAL 189 depends on MFD_SYSCON 190 depends on OF 191 help 192 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs. 193 It supports one critical trip point and one passive trip point. The 194 cpufreq is used as the cooling device to throttle CPUs when the 195 passive trip is crossed. 196 197config SPEAR_THERMAL 198 bool "SPEAr thermal sensor driver" 199 depends on PLAT_SPEAR || COMPILE_TEST 200 depends on OF 201 help 202 Enable this to plug the SPEAr thermal sensor driver into the Linux 203 thermal framework. 204 205config ROCKCHIP_THERMAL 206 tristate "Rockchip thermal driver" 207 depends on ARCH_ROCKCHIP || COMPILE_TEST 208 depends on RESET_CONTROLLER 209 help 210 Rockchip thermal driver provides support for Temperature sensor 211 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical 212 trip point. Cpufreq is used as the cooling device and will throttle 213 CPUs when the Temperature crosses the passive trip point. 214 215config RCAR_THERMAL 216 tristate "Renesas R-Car thermal driver" 217 depends on ARCH_SHMOBILE || COMPILE_TEST 218 depends on HAS_IOMEM 219 help 220 Enable this to plug the R-Car thermal sensor driver into the Linux 221 thermal framework. 222 223config KIRKWOOD_THERMAL 224 tristate "Temperature sensor on Marvell Kirkwood SoCs" 225 depends on MACH_KIRKWOOD || COMPILE_TEST 226 depends on OF 227 help 228 Support for the Kirkwood thermal sensor driver into the Linux thermal 229 framework. Only kirkwood 88F6282 and 88F6283 have this sensor. 230 231config DOVE_THERMAL 232 tristate "Temperature sensor on Marvell Dove SoCs" 233 depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST 234 depends on OF 235 help 236 Support for the Dove thermal sensor driver in the Linux thermal 237 framework. 238 239config DB8500_THERMAL 240 bool "DB8500 thermal management" 241 depends on ARCH_U8500 242 default y 243 help 244 Adds DB8500 thermal management implementation according to the thermal 245 management framework. A thermal zone with several trip points will be 246 created. Cooling devices can be bound to the trip points to cool this 247 thermal zone if trip points reached. 248 249config ARMADA_THERMAL 250 tristate "Armada 370/XP thermal management" 251 depends on ARCH_MVEBU || COMPILE_TEST 252 depends on OF 253 help 254 Enable this option if you want to have support for thermal management 255 controller present in Armada 370 and Armada XP SoC. 256 257config TEGRA_SOCTHERM 258 tristate "Tegra SOCTHERM thermal management" 259 depends on ARCH_TEGRA 260 help 261 Enable this option for integrated thermal management support on NVIDIA 262 Tegra124 systems-on-chip. The driver supports four thermal zones 263 (CPU, GPU, MEM, PLLX). Cooling devices can be bound to the thermal 264 zones to manage temperatures. This option is also required for the 265 emergency thermal reset (thermtrip) feature to function. 266 267config DB8500_CPUFREQ_COOLING 268 tristate "DB8500 cpufreq cooling" 269 depends on ARCH_U8500 270 depends on CPU_THERMAL 271 default y 272 help 273 Adds DB8500 cpufreq cooling devices, and these cooling devices can be 274 bound to thermal zone trip points. When a trip point reached, the 275 bound cpufreq cooling device turns active to set CPU frequency low to 276 cool down the CPU. 277 278config INTEL_POWERCLAMP 279 tristate "Intel PowerClamp idle injection driver" 280 depends on THERMAL 281 depends on X86 282 depends on CPU_SUP_INTEL 283 help 284 Enable this to enable Intel PowerClamp idle injection driver. This 285 enforce idle time which results in more package C-state residency. The 286 user interface is exposed via generic thermal framework. 287 288config X86_PKG_TEMP_THERMAL 289 tristate "X86 package temperature thermal driver" 290 depends on X86_THERMAL_VECTOR 291 select THERMAL_GOV_USER_SPACE 292 select THERMAL_WRITABLE_TRIPS 293 default m 294 help 295 Enable this to register CPU digital sensor for package temperature as 296 thermal zone. Each package will have its own thermal zone. There are 297 two trip points which can be set by user to get notifications via thermal 298 notification methods. 299 300config INTEL_SOC_DTS_IOSF_CORE 301 tristate 302 depends on X86 303 select IOSF_MBI 304 help 305 This is becoming a common feature for Intel SoCs to expose the additional 306 digital temperature sensors (DTSs) using side band interface (IOSF). This 307 implements the common set of helper functions to register, get temperature 308 and get/set thresholds on DTSs. 309 310config INTEL_SOC_DTS_THERMAL 311 tristate "Intel SoCs DTS thermal driver" 312 depends on X86 313 select INTEL_SOC_DTS_IOSF_CORE 314 select THERMAL_WRITABLE_TRIPS 315 help 316 Enable this to register Intel SoCs (e.g. Bay Trail) platform digital 317 temperature sensor (DTS). These SoCs have two additional DTSs in 318 addition to DTSs on CPU cores. Each DTS will be registered as a 319 thermal zone. There are two trip points. One of the trip point can 320 be set by user mode programs to get notifications via Linux thermal 321 notification methods.The other trip is a critical trip point, which 322 was set by the driver based on the TJ MAX temperature. 323 324config INTEL_QUARK_DTS_THERMAL 325 tristate "Intel Quark DTS thermal driver" 326 depends on X86_INTEL_QUARK 327 help 328 Enable this to register Intel Quark SoC (e.g. X1000) platform digital 329 temperature sensor (DTS). For X1000 SoC, it has one on-die DTS. 330 The DTS will be registered as a thermal zone. There are two trip points: 331 hot & critical. The critical trip point default value is set by 332 underlying BIOS/Firmware. 333 334config INT340X_THERMAL 335 tristate "ACPI INT340X thermal drivers" 336 depends on X86 && ACPI 337 select THERMAL_GOV_USER_SPACE 338 select ACPI_THERMAL_REL 339 select ACPI_FAN 340 select INTEL_SOC_DTS_IOSF_CORE 341 select THERMAL_WRITABLE_TRIPS 342 help 343 Newer laptops and tablets that use ACPI may have thermal sensors and 344 other devices with thermal control capabilities outside the core 345 CPU/SOC, for thermal safety reasons. 346 They are exposed for the OS to use via the INT3400 ACPI device object 347 as the master, and INT3401~INT340B ACPI device objects as the slaves. 348 Enable this to expose the temperature information and cooling ability 349 from these objects to userspace via the normal thermal framework. 350 This means that a wide range of applications and GUI widgets can show 351 the information to the user or use this information for making 352 decisions. For example, the Intel Thermal Daemon can use this 353 information to allow the user to select his laptop to run without 354 turning on the fans. 355 356config ACPI_THERMAL_REL 357 tristate 358 depends on ACPI 359 360config INTEL_PCH_THERMAL 361 tristate "Intel PCH Thermal Reporting Driver" 362 depends on X86 && PCI 363 help 364 Enable this to support thermal reporting on certain intel PCHs. 365 Thermal reporting device will provide temperature reading, 366 programmable trip points and other information. 367 368menu "Texas Instruments thermal drivers" 369depends on ARCH_HAS_BANDGAP || COMPILE_TEST 370source "drivers/thermal/ti-soc-thermal/Kconfig" 371endmenu 372 373menu "Samsung thermal drivers" 374depends on ARCH_EXYNOS || COMPILE_TEST 375source "drivers/thermal/samsung/Kconfig" 376endmenu 377 378menu "STMicroelectronics thermal drivers" 379depends on ARCH_STI && OF 380source "drivers/thermal/st/Kconfig" 381endmenu 382 383config QCOM_SPMI_TEMP_ALARM 384 tristate "Qualcomm SPMI PMIC Temperature Alarm" 385 depends on OF && SPMI && IIO 386 select REGMAP_SPMI 387 help 388 This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP) 389 PMIC devices. It shows up in sysfs as a thermal sensor with multiple 390 trip points. The temperature reported by the thermal sensor reflects the 391 real time die temperature if an ADC is present or an estimate of the 392 temperature based upon the over temperature stage value. 393 394endif 395