1# 2# Generic thermal sysfs drivers configuration 3# 4 5menuconfig THERMAL 6 tristate "Generic Thermal sysfs driver" 7 help 8 Generic Thermal Sysfs driver offers a generic mechanism for 9 thermal management. Usually it's made up of one or more thermal 10 zone and cooling device. 11 Each thermal zone contains its own temperature, trip points, 12 cooling devices. 13 All platforms with ACPI thermal support can use this driver. 14 If you want this support, you should say Y or M here. 15 16if THERMAL 17 18config THERMAL_HWMON 19 bool 20 prompt "Expose thermal sensors as hwmon device" 21 depends on HWMON=y || HWMON=THERMAL 22 default y 23 help 24 In case a sensor is registered with the thermal 25 framework, this option will also register it 26 as a hwmon. The sensor will then have the common 27 hwmon sysfs interface. 28 29 Say 'Y' here if you want all thermal sensors to 30 have hwmon sysfs interface too. 31 32config THERMAL_OF 33 bool 34 prompt "APIs to parse thermal data out of device tree" 35 depends on OF 36 default y 37 help 38 This options provides helpers to add the support to 39 read and parse thermal data definitions out of the 40 device tree blob. 41 42 Say 'Y' here if you need to build thermal infrastructure 43 based on device tree. 44 45config THERMAL_WRITABLE_TRIPS 46 bool "Enable writable trip points" 47 help 48 This option allows the system integrator to choose whether 49 trip temperatures can be changed from userspace. The 50 writable trips need to be specified when setting up the 51 thermal zone but the choice here takes precedence. 52 53 Say 'Y' here if you would like to allow userspace tools to 54 change trip temperatures. 55 56choice 57 prompt "Default Thermal governor" 58 default THERMAL_DEFAULT_GOV_STEP_WISE 59 help 60 This option sets which thermal governor shall be loaded at 61 startup. If in doubt, select 'step_wise'. 62 63config THERMAL_DEFAULT_GOV_STEP_WISE 64 bool "step_wise" 65 select THERMAL_GOV_STEP_WISE 66 help 67 Use the step_wise governor as default. This throttles the 68 devices one step at a time. 69 70config THERMAL_DEFAULT_GOV_FAIR_SHARE 71 bool "fair_share" 72 select THERMAL_GOV_FAIR_SHARE 73 help 74 Use the fair_share governor as default. This throttles the 75 devices based on their 'contribution' to a zone. The 76 contribution should be provided through platform data. 77 78config THERMAL_DEFAULT_GOV_USER_SPACE 79 bool "user_space" 80 select THERMAL_GOV_USER_SPACE 81 help 82 Select this if you want to let the user space manage the 83 platform thermals. 84 85config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR 86 bool "power_allocator" 87 select THERMAL_GOV_POWER_ALLOCATOR 88 help 89 Select this if you want to control temperature based on 90 system and device power allocation. This governor can only 91 operate on cooling devices that implement the power API. 92 93endchoice 94 95config THERMAL_GOV_FAIR_SHARE 96 bool "Fair-share thermal governor" 97 help 98 Enable this to manage platform thermals using fair-share governor. 99 100config THERMAL_GOV_STEP_WISE 101 bool "Step_wise thermal governor" 102 help 103 Enable this to manage platform thermals using a simple linear 104 governor. 105 106config THERMAL_GOV_BANG_BANG 107 bool "Bang Bang thermal governor" 108 default n 109 help 110 Enable this to manage platform thermals using bang bang governor. 111 112 Say 'Y' here if you want to use two point temperature regulation 113 used for fans without throttling. Some fan drivers depend on this 114 governor to be enabled (e.g. acerhdf). 115 116config THERMAL_GOV_USER_SPACE 117 bool "User_space thermal governor" 118 help 119 Enable this to let the user space manage the platform thermals. 120 121config THERMAL_GOV_POWER_ALLOCATOR 122 bool "Power allocator thermal governor" 123 help 124 Enable this to manage platform thermals by dynamically 125 allocating and limiting power to devices. 126 127config CPU_THERMAL 128 bool "generic cpu cooling support" 129 depends on CPU_FREQ 130 depends on THERMAL_OF 131 help 132 This implements the generic cpu cooling mechanism through frequency 133 reduction. An ACPI version of this already exists 134 (drivers/acpi/processor_thermal.c). 135 This will be useful for platforms using the generic thermal interface 136 and not the ACPI interface. 137 138 If you want this support, you should say Y here. 139 140config CLOCK_THERMAL 141 bool "Generic clock cooling support" 142 depends on COMMON_CLK 143 depends on PM_OPP 144 help 145 This entry implements the generic clock cooling mechanism through 146 frequency clipping. Typically used to cool off co-processors. The 147 device that is configured to use this cooling mechanism will be 148 controlled to reduce clock frequency whenever temperature is high. 149 150 If you want this support, you should say Y here. 151 152config THERMAL_EMULATION 153 bool "Thermal emulation mode support" 154 help 155 Enable this option to make a emul_temp sysfs node in thermal zone 156 directory to support temperature emulation. With emulation sysfs node, 157 user can manually input temperature and test the different trip 158 threshold behaviour for simulation purpose. 159 160 WARNING: Be careful while enabling this option on production systems, 161 because userland can easily disable the thermal policy by simply 162 flooding this sysfs node with low temperature values. 163 164config HISI_THERMAL 165 tristate "Hisilicon thermal driver" 166 depends on ARCH_HISI && CPU_THERMAL && OF 167 help 168 Enable this to plug hisilicon's thermal sensor driver into the Linux 169 thermal framework. cpufreq is used as the cooling device to throttle 170 CPUs when the passive trip is crossed. 171 172config IMX_THERMAL 173 tristate "Temperature sensor driver for Freescale i.MX SoCs" 174 depends on CPU_THERMAL 175 depends on MFD_SYSCON 176 depends on OF 177 help 178 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs. 179 It supports one critical trip point and one passive trip point. The 180 cpufreq is used as the cooling device to throttle CPUs when the 181 passive trip is crossed. 182 183config SPEAR_THERMAL 184 bool "SPEAr thermal sensor driver" 185 depends on PLAT_SPEAR 186 depends on OF 187 help 188 Enable this to plug the SPEAr thermal sensor driver into the Linux 189 thermal framework. 190 191config ROCKCHIP_THERMAL 192 tristate "Rockchip thermal driver" 193 depends on ARCH_ROCKCHIP 194 depends on RESET_CONTROLLER 195 help 196 Rockchip thermal driver provides support for Temperature sensor 197 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical 198 trip point. Cpufreq is used as the cooling device and will throttle 199 CPUs when the Temperature crosses the passive trip point. 200 201config RCAR_THERMAL 202 tristate "Renesas R-Car thermal driver" 203 depends on ARCH_SHMOBILE || COMPILE_TEST 204 depends on HAS_IOMEM 205 help 206 Enable this to plug the R-Car thermal sensor driver into the Linux 207 thermal framework. 208 209config KIRKWOOD_THERMAL 210 tristate "Temperature sensor on Marvell Kirkwood SoCs" 211 depends on MACH_KIRKWOOD 212 depends on OF 213 help 214 Support for the Kirkwood thermal sensor driver into the Linux thermal 215 framework. Only kirkwood 88F6282 and 88F6283 have this sensor. 216 217config DOVE_THERMAL 218 tristate "Temperature sensor on Marvell Dove SoCs" 219 depends on ARCH_DOVE || MACH_DOVE 220 depends on OF 221 help 222 Support for the Dove thermal sensor driver in the Linux thermal 223 framework. 224 225config DB8500_THERMAL 226 bool "DB8500 thermal management" 227 depends on ARCH_U8500 228 default y 229 help 230 Adds DB8500 thermal management implementation according to the thermal 231 management framework. A thermal zone with several trip points will be 232 created. Cooling devices can be bound to the trip points to cool this 233 thermal zone if trip points reached. 234 235config ARMADA_THERMAL 236 tristate "Armada 370/XP thermal management" 237 depends on ARCH_MVEBU 238 depends on OF 239 help 240 Enable this option if you want to have support for thermal management 241 controller present in Armada 370 and Armada XP SoC. 242 243config TEGRA_SOCTHERM 244 tristate "Tegra SOCTHERM thermal management" 245 depends on ARCH_TEGRA 246 help 247 Enable this option for integrated thermal management support on NVIDIA 248 Tegra124 systems-on-chip. The driver supports four thermal zones 249 (CPU, GPU, MEM, PLLX). Cooling devices can be bound to the thermal 250 zones to manage temperatures. This option is also required for the 251 emergency thermal reset (thermtrip) feature to function. 252 253config DB8500_CPUFREQ_COOLING 254 tristate "DB8500 cpufreq cooling" 255 depends on ARCH_U8500 256 depends on CPU_THERMAL 257 default y 258 help 259 Adds DB8500 cpufreq cooling devices, and these cooling devices can be 260 bound to thermal zone trip points. When a trip point reached, the 261 bound cpufreq cooling device turns active to set CPU frequency low to 262 cool down the CPU. 263 264config INTEL_POWERCLAMP 265 tristate "Intel PowerClamp idle injection driver" 266 depends on THERMAL 267 depends on X86 268 depends on CPU_SUP_INTEL 269 help 270 Enable this to enable Intel PowerClamp idle injection driver. This 271 enforce idle time which results in more package C-state residency. The 272 user interface is exposed via generic thermal framework. 273 274config X86_PKG_TEMP_THERMAL 275 tristate "X86 package temperature thermal driver" 276 depends on X86_THERMAL_VECTOR 277 select THERMAL_GOV_USER_SPACE 278 default m 279 help 280 Enable this to register CPU digital sensor for package temperature as 281 thermal zone. Each package will have its own thermal zone. There are 282 two trip points which can be set by user to get notifications via thermal 283 notification methods. 284 285config INTEL_SOC_DTS_IOSF_CORE 286 tristate 287 depends on X86 288 select IOSF_MBI 289 help 290 This is becoming a common feature for Intel SoCs to expose the additional 291 digital temperature sensors (DTSs) using side band interface (IOSF). This 292 implements the common set of helper functions to register, get temperature 293 and get/set thresholds on DTSs. 294 295config INTEL_SOC_DTS_THERMAL 296 tristate "Intel SoCs DTS thermal driver" 297 depends on X86 298 select INTEL_SOC_DTS_IOSF_CORE 299 help 300 Enable this to register Intel SoCs (e.g. Bay Trail) platform digital 301 temperature sensor (DTS). These SoCs have two additional DTSs in 302 addition to DTSs on CPU cores. Each DTS will be registered as a 303 thermal zone. There are two trip points. One of the trip point can 304 be set by user mode programs to get notifications via Linux thermal 305 notification methods.The other trip is a critical trip point, which 306 was set by the driver based on the TJ MAX temperature. 307 308config INTEL_QUARK_DTS_THERMAL 309 tristate "Intel Quark DTS thermal driver" 310 depends on X86_INTEL_QUARK 311 help 312 Enable this to register Intel Quark SoC (e.g. X1000) platform digital 313 temperature sensor (DTS). For X1000 SoC, it has one on-die DTS. 314 The DTS will be registered as a thermal zone. There are two trip points: 315 hot & critical. The critical trip point default value is set by 316 underlying BIOS/Firmware. 317 318config INT340X_THERMAL 319 tristate "ACPI INT340X thermal drivers" 320 depends on X86 && ACPI 321 select THERMAL_GOV_USER_SPACE 322 select ACPI_THERMAL_REL 323 select ACPI_FAN 324 select INTEL_SOC_DTS_IOSF_CORE 325 help 326 Newer laptops and tablets that use ACPI may have thermal sensors and 327 other devices with thermal control capabilities outside the core 328 CPU/SOC, for thermal safety reasons. 329 They are exposed for the OS to use via the INT3400 ACPI device object 330 as the master, and INT3401~INT340B ACPI device objects as the slaves. 331 Enable this to expose the temperature information and cooling ability 332 from these objects to userspace via the normal thermal framework. 333 This means that a wide range of applications and GUI widgets can show 334 the information to the user or use this information for making 335 decisions. For example, the Intel Thermal Daemon can use this 336 information to allow the user to select his laptop to run without 337 turning on the fans. 338 339config ACPI_THERMAL_REL 340 tristate 341 depends on ACPI 342 343menu "Texas Instruments thermal drivers" 344source "drivers/thermal/ti-soc-thermal/Kconfig" 345endmenu 346 347menu "Samsung thermal drivers" 348depends on ARCH_EXYNOS 349source "drivers/thermal/samsung/Kconfig" 350endmenu 351 352menu "STMicroelectronics thermal drivers" 353depends on ARCH_STI && OF 354source "drivers/thermal/st/Kconfig" 355endmenu 356 357config QCOM_SPMI_TEMP_ALARM 358 tristate "Qualcomm SPMI PMIC Temperature Alarm" 359 depends on OF && SPMI && IIO 360 select REGMAP_SPMI 361 help 362 This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP) 363 PMIC devices. It shows up in sysfs as a thermal sensor with multiple 364 trip points. The temperature reported by the thermal sensor reflects the 365 real time die temperature if an ADC is present or an estimate of the 366 temperature based upon the over temperature stage value. 367 368endif 369