xref: /openbmc/linux/drivers/thermal/Kconfig (revision 56d06fa2)
1#
2# Generic thermal sysfs drivers configuration
3#
4
5menuconfig THERMAL
6	tristate "Generic Thermal sysfs driver"
7	help
8	  Generic Thermal Sysfs driver offers a generic mechanism for
9	  thermal management. Usually it's made up of one or more thermal
10	  zone and cooling device.
11	  Each thermal zone contains its own temperature, trip points,
12	  cooling devices.
13	  All platforms with ACPI thermal support can use this driver.
14	  If you want this support, you should say Y or M here.
15
16if THERMAL
17
18config THERMAL_HWMON
19	bool
20	prompt "Expose thermal sensors as hwmon device"
21	depends on HWMON=y || HWMON=THERMAL
22	default y
23	help
24	  In case a sensor is registered with the thermal
25	  framework, this option will also register it
26	  as a hwmon. The sensor will then have the common
27	  hwmon sysfs interface.
28
29	  Say 'Y' here if you want all thermal sensors to
30	  have hwmon sysfs interface too.
31
32config THERMAL_OF
33	bool
34	prompt "APIs to parse thermal data out of device tree"
35	depends on OF
36	default y
37	help
38	  This options provides helpers to add the support to
39	  read and parse thermal data definitions out of the
40	  device tree blob.
41
42	  Say 'Y' here if you need to build thermal infrastructure
43	  based on device tree.
44
45config THERMAL_WRITABLE_TRIPS
46	bool "Enable writable trip points"
47	help
48	  This option allows the system integrator to choose whether
49	  trip temperatures can be changed from userspace. The
50	  writable trips need to be specified when setting up the
51	  thermal zone but the choice here takes precedence.
52
53	  Say 'Y' here if you would like to allow userspace tools to
54	  change trip temperatures.
55
56choice
57	prompt "Default Thermal governor"
58	default THERMAL_DEFAULT_GOV_STEP_WISE
59	help
60	  This option sets which thermal governor shall be loaded at
61	  startup. If in doubt, select 'step_wise'.
62
63config THERMAL_DEFAULT_GOV_STEP_WISE
64	bool "step_wise"
65	select THERMAL_GOV_STEP_WISE
66	help
67	  Use the step_wise governor as default. This throttles the
68	  devices one step at a time.
69
70config THERMAL_DEFAULT_GOV_FAIR_SHARE
71	bool "fair_share"
72	select THERMAL_GOV_FAIR_SHARE
73	help
74	  Use the fair_share governor as default. This throttles the
75	  devices based on their 'contribution' to a zone. The
76	  contribution should be provided through platform data.
77
78config THERMAL_DEFAULT_GOV_USER_SPACE
79	bool "user_space"
80	select THERMAL_GOV_USER_SPACE
81	help
82	  Select this if you want to let the user space manage the
83	  platform thermals.
84
85config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
86	bool "power_allocator"
87	select THERMAL_GOV_POWER_ALLOCATOR
88	help
89	  Select this if you want to control temperature based on
90	  system and device power allocation. This governor can only
91	  operate on cooling devices that implement the power API.
92
93endchoice
94
95config THERMAL_GOV_FAIR_SHARE
96	bool "Fair-share thermal governor"
97	help
98	  Enable this to manage platform thermals using fair-share governor.
99
100config THERMAL_GOV_STEP_WISE
101	bool "Step_wise thermal governor"
102	help
103	  Enable this to manage platform thermals using a simple linear
104	  governor.
105
106config THERMAL_GOV_BANG_BANG
107	bool "Bang Bang thermal governor"
108	default n
109	help
110	  Enable this to manage platform thermals using bang bang governor.
111
112	  Say 'Y' here if you want to use two point temperature regulation
113	  used for fans without throttling.  Some fan drivers depend on this
114	  governor to be enabled (e.g. acerhdf).
115
116config THERMAL_GOV_USER_SPACE
117	bool "User_space thermal governor"
118	help
119	  Enable this to let the user space manage the platform thermals.
120
121config THERMAL_GOV_POWER_ALLOCATOR
122	bool "Power allocator thermal governor"
123	help
124	  Enable this to manage platform thermals by dynamically
125	  allocating and limiting power to devices.
126
127config CPU_THERMAL
128	bool "generic cpu cooling support"
129	depends on CPU_FREQ
130	depends on THERMAL_OF
131	help
132	  This implements the generic cpu cooling mechanism through frequency
133	  reduction. An ACPI version of this already exists
134	  (drivers/acpi/processor_thermal.c).
135	  This will be useful for platforms using the generic thermal interface
136	  and not the ACPI interface.
137
138	  If you want this support, you should say Y here.
139
140config CLOCK_THERMAL
141	bool "Generic clock cooling support"
142	depends on COMMON_CLK
143	depends on PM_OPP
144	help
145	  This entry implements the generic clock cooling mechanism through
146	  frequency clipping. Typically used to cool off co-processors. The
147	  device that is configured to use this cooling mechanism will be
148	  controlled to reduce clock frequency whenever temperature is high.
149
150config DEVFREQ_THERMAL
151	bool "Generic device cooling support"
152	depends on PM_DEVFREQ
153	depends on PM_OPP
154	help
155	  This implements the generic devfreq cooling mechanism through
156	  frequency reduction for devices using devfreq.
157
158	  This will throttle the device by limiting the maximum allowed DVFS
159	  frequency corresponding to the cooling level.
160
161	  In order to use the power extensions of the cooling device,
162	  devfreq should use the simple_ondemand governor.
163
164	  If you want this support, you should say Y here.
165
166config THERMAL_EMULATION
167	bool "Thermal emulation mode support"
168	help
169	  Enable this option to make a emul_temp sysfs node in thermal zone
170	  directory to support temperature emulation. With emulation sysfs node,
171	  user can manually input temperature and test the different trip
172	  threshold behaviour for simulation purpose.
173
174	  WARNING: Be careful while enabling this option on production systems,
175	  because userland can easily disable the thermal policy by simply
176	  flooding this sysfs node with low temperature values.
177
178config HISI_THERMAL
179	tristate "Hisilicon thermal driver"
180	depends on (ARCH_HISI && CPU_THERMAL && OF) || COMPILE_TEST
181	depends on HAS_IOMEM
182	help
183	  Enable this to plug hisilicon's thermal sensor driver into the Linux
184	  thermal framework. cpufreq is used as the cooling device to throttle
185	  CPUs when the passive trip is crossed.
186
187config IMX_THERMAL
188	tristate "Temperature sensor driver for Freescale i.MX SoCs"
189	depends on CPU_THERMAL
190	depends on MFD_SYSCON
191	depends on OF
192	help
193	  Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
194	  It supports one critical trip point and one passive trip point.  The
195	  cpufreq is used as the cooling device to throttle CPUs when the
196	  passive trip is crossed.
197
198config SPEAR_THERMAL
199	tristate "SPEAr thermal sensor driver"
200	depends on PLAT_SPEAR || COMPILE_TEST
201	depends on HAS_IOMEM
202	depends on OF
203	help
204	  Enable this to plug the SPEAr thermal sensor driver into the Linux
205	  thermal framework.
206
207config ROCKCHIP_THERMAL
208	tristate "Rockchip thermal driver"
209	depends on ARCH_ROCKCHIP || COMPILE_TEST
210	depends on RESET_CONTROLLER
211	depends on HAS_IOMEM
212	help
213	  Rockchip thermal driver provides support for Temperature sensor
214	  ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
215	  trip point. Cpufreq is used as the cooling device and will throttle
216	  CPUs when the Temperature crosses the passive trip point.
217
218config RCAR_THERMAL
219	tristate "Renesas R-Car thermal driver"
220	depends on ARCH_RENESAS || COMPILE_TEST
221	depends on HAS_IOMEM
222	help
223	  Enable this to plug the R-Car thermal sensor driver into the Linux
224	  thermal framework.
225
226config KIRKWOOD_THERMAL
227	tristate "Temperature sensor on Marvell Kirkwood SoCs"
228	depends on MACH_KIRKWOOD || COMPILE_TEST
229	depends on HAS_IOMEM
230	depends on OF
231	help
232	  Support for the Kirkwood thermal sensor driver into the Linux thermal
233	  framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
234
235config DOVE_THERMAL
236	tristate "Temperature sensor on Marvell Dove SoCs"
237	depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
238	depends on HAS_IOMEM
239	depends on OF
240	help
241	  Support for the Dove thermal sensor driver in the Linux thermal
242	  framework.
243
244config DB8500_THERMAL
245	tristate "DB8500 thermal management"
246	depends on MFD_DB8500_PRCMU
247	default y
248	help
249	  Adds DB8500 thermal management implementation according to the thermal
250	  management framework. A thermal zone with several trip points will be
251	  created. Cooling devices can be bound to the trip points to cool this
252	  thermal zone if trip points reached.
253
254config ARMADA_THERMAL
255	tristate "Armada 370/XP thermal management"
256	depends on ARCH_MVEBU || COMPILE_TEST
257	depends on HAS_IOMEM
258	depends on OF
259	help
260	  Enable this option if you want to have support for thermal management
261	  controller present in Armada 370 and Armada XP SoC.
262
263config TEGRA_SOCTHERM
264	tristate "Tegra SOCTHERM thermal management"
265	depends on ARCH_TEGRA
266	help
267	  Enable this option for integrated thermal management support on NVIDIA
268	  Tegra124 systems-on-chip. The driver supports four thermal zones
269	  (CPU, GPU, MEM, PLLX). Cooling devices can be bound to the thermal
270	  zones to manage temperatures. This option is also required for the
271	  emergency thermal reset (thermtrip) feature to function.
272
273config DB8500_CPUFREQ_COOLING
274	tristate "DB8500 cpufreq cooling"
275	depends on ARCH_U8500 || COMPILE_TEST
276	depends on HAS_IOMEM
277	depends on CPU_THERMAL
278	default y
279	help
280	  Adds DB8500 cpufreq cooling devices, and these cooling devices can be
281	  bound to thermal zone trip points. When a trip point reached, the
282	  bound cpufreq cooling device turns active to set CPU frequency low to
283	  cool down the CPU.
284
285config INTEL_POWERCLAMP
286	tristate "Intel PowerClamp idle injection driver"
287	depends on THERMAL
288	depends on X86
289	depends on CPU_SUP_INTEL
290	help
291	  Enable this to enable Intel PowerClamp idle injection driver. This
292	  enforce idle time which results in more package C-state residency. The
293	  user interface is exposed via generic thermal framework.
294
295config X86_PKG_TEMP_THERMAL
296	tristate "X86 package temperature thermal driver"
297	depends on X86_THERMAL_VECTOR
298	select THERMAL_GOV_USER_SPACE
299	select THERMAL_WRITABLE_TRIPS
300	default m
301	help
302	  Enable this to register CPU digital sensor for package temperature as
303	  thermal zone. Each package will have its own thermal zone. There are
304	  two trip points which can be set by user to get notifications via thermal
305	  notification methods.
306
307config INTEL_SOC_DTS_IOSF_CORE
308	tristate
309	depends on X86
310	select IOSF_MBI
311	help
312	  This is becoming a common feature for Intel SoCs to expose the additional
313	  digital temperature sensors (DTSs) using side band interface (IOSF). This
314	  implements the common set of helper functions to register, get temperature
315	  and get/set thresholds on DTSs.
316
317config INTEL_SOC_DTS_THERMAL
318	tristate "Intel SoCs DTS thermal driver"
319	depends on X86
320	select INTEL_SOC_DTS_IOSF_CORE
321	select THERMAL_WRITABLE_TRIPS
322	help
323	  Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
324	  temperature sensor (DTS). These SoCs have two additional DTSs in
325	  addition to DTSs on CPU cores. Each DTS will be registered as a
326	  thermal zone. There are two trip points. One of the trip point can
327	  be set by user mode programs to get notifications via Linux thermal
328	  notification methods.The other trip is a critical trip point, which
329	  was set by the driver based on the TJ MAX temperature.
330
331config INTEL_QUARK_DTS_THERMAL
332	tristate "Intel Quark DTS thermal driver"
333	depends on X86_INTEL_QUARK
334	help
335	  Enable this to register Intel Quark SoC (e.g. X1000) platform digital
336	  temperature sensor (DTS). For X1000 SoC, it has one on-die DTS.
337	  The DTS will be registered as a thermal zone. There are two trip points:
338	  hot & critical. The critical trip point default value is set by
339	  underlying BIOS/Firmware.
340
341config INT340X_THERMAL
342	tristate "ACPI INT340X thermal drivers"
343	depends on X86 && ACPI
344	select THERMAL_GOV_USER_SPACE
345	select ACPI_THERMAL_REL
346	select ACPI_FAN
347	select INTEL_SOC_DTS_IOSF_CORE
348	select THERMAL_WRITABLE_TRIPS
349	help
350	  Newer laptops and tablets that use ACPI may have thermal sensors and
351	  other devices with thermal control capabilities outside the core
352	  CPU/SOC, for thermal safety reasons.
353	  They are exposed for the OS to use via the INT3400 ACPI device object
354	  as the master, and INT3401~INT340B ACPI device objects as the slaves.
355	  Enable this to expose the temperature information and cooling ability
356	  from these objects to userspace via the normal thermal framework.
357	  This means that a wide range of applications and GUI widgets can show
358	  the information to the user or use this information for making
359	  decisions. For example, the Intel Thermal Daemon can use this
360	  information to allow the user to select his laptop to run without
361	  turning on the fans.
362
363config ACPI_THERMAL_REL
364	tristate
365	depends on ACPI
366
367config INTEL_PCH_THERMAL
368	tristate "Intel PCH Thermal Reporting Driver"
369	depends on X86 && PCI
370	help
371	  Enable this to support thermal reporting on certain intel PCHs.
372	  Thermal reporting device will provide temperature reading,
373	  programmable trip points and other information.
374
375config MTK_THERMAL
376	tristate "Temperature sensor driver for mediatek SoCs"
377	depends on ARCH_MEDIATEK || COMPILE_TEST
378	depends on HAS_IOMEM
379	depends on NVMEM || NVMEM=n
380	depends on RESET_CONTROLLER
381	default y
382	help
383	  Enable this option if you want to have support for thermal management
384	  controller present in Mediatek SoCs
385
386menu "Texas Instruments thermal drivers"
387depends on ARCH_HAS_BANDGAP || COMPILE_TEST
388depends on HAS_IOMEM
389source "drivers/thermal/ti-soc-thermal/Kconfig"
390endmenu
391
392menu "Samsung thermal drivers"
393depends on ARCH_EXYNOS || COMPILE_TEST
394source "drivers/thermal/samsung/Kconfig"
395endmenu
396
397menu "STMicroelectronics thermal drivers"
398depends on ARCH_STI && OF
399source "drivers/thermal/st/Kconfig"
400endmenu
401
402config QCOM_SPMI_TEMP_ALARM
403	tristate "Qualcomm SPMI PMIC Temperature Alarm"
404	depends on OF && SPMI && IIO
405	select REGMAP_SPMI
406	help
407	  This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP)
408	  PMIC devices. It shows up in sysfs as a thermal sensor with multiple
409	  trip points. The temperature reported by the thermal sensor reflects the
410	  real time die temperature if an ADC is present or an estimate of the
411	  temperature based upon the over temperature stage value.
412
413endif
414