1# SPDX-License-Identifier: GPL-2.0-only 2# 3# Generic thermal drivers configuration 4# 5 6menuconfig THERMAL 7 bool "Thermal drivers" 8 help 9 Thermal drivers offer a generic mechanism for 10 thermal management. Usually it's made up of one or more thermal 11 zones and cooling devices. 12 Each thermal zone contains its own temperature, trip points, 13 and cooling devices. 14 All platforms with ACPI or Open Firmware thermal support can use 15 this driver. 16 If you want this support, you should say Y here. 17 18if THERMAL 19 20config THERMAL_NETLINK 21 bool "Thermal netlink management" 22 depends on NET 23 help 24 The thermal framework has a netlink interface to do thermal 25 zones discovery, temperature readings and events such as 26 trip point crossed, cooling device update or governor 27 change. It is recommended to enable the feature. 28 29config THERMAL_STATISTICS 30 bool "Thermal state transition statistics" 31 help 32 Export thermal state transition statistics information through sysfs. 33 34 If in doubt, say N. 35 36config THERMAL_EMERGENCY_POWEROFF_DELAY_MS 37 int "Emergency poweroff delay in milli-seconds" 38 default 0 39 help 40 Thermal subsystem will issue a graceful shutdown when 41 critical temperatures are reached using orderly_poweroff(). In 42 case of failure of an orderly_poweroff(), the thermal emergency 43 poweroff kicks in after a delay has elapsed and shuts down the system. 44 This config is number of milliseconds to delay before emergency 45 poweroff kicks in. Similarly to the critical trip point, 46 the delay should be carefully profiled so as to give adequate 47 time for orderly_poweroff() to finish on regular execution. 48 If set to 0 emergency poweroff will not be supported. 49 50 In doubt, leave as 0. 51 52config THERMAL_HWMON 53 bool 54 prompt "Expose thermal sensors as hwmon device" 55 depends on HWMON=y || HWMON=THERMAL 56 default y 57 help 58 In case a sensor is registered with the thermal 59 framework, this option will also register it 60 as a hwmon. The sensor will then have the common 61 hwmon sysfs interface. 62 63 Say 'Y' here if you want all thermal sensors to 64 have hwmon sysfs interface too. 65 66config THERMAL_OF 67 bool 68 prompt "APIs to parse thermal data out of device tree" 69 depends on OF 70 default y 71 help 72 This options provides helpers to add the support to 73 read and parse thermal data definitions out of the 74 device tree blob. 75 76 Say 'Y' here if you need to build thermal infrastructure 77 based on device tree. 78 79config THERMAL_ACPI 80 depends on ACPI 81 bool 82 83config THERMAL_WRITABLE_TRIPS 84 bool "Enable writable trip points" 85 help 86 This option allows the system integrator to choose whether 87 trip temperatures can be changed from userspace. The 88 writable trips need to be specified when setting up the 89 thermal zone but the choice here takes precedence. 90 91 Say 'Y' here if you would like to allow userspace tools to 92 change trip temperatures. 93 94choice 95 prompt "Default Thermal governor" 96 default THERMAL_DEFAULT_GOV_STEP_WISE 97 help 98 This option sets which thermal governor shall be loaded at 99 startup. If in doubt, select 'step_wise'. 100 101config THERMAL_DEFAULT_GOV_STEP_WISE 102 bool "step_wise" 103 select THERMAL_GOV_STEP_WISE 104 help 105 Use the step_wise governor as default. This throttles the 106 devices one step at a time. 107 108config THERMAL_DEFAULT_GOV_FAIR_SHARE 109 bool "fair_share" 110 select THERMAL_GOV_FAIR_SHARE 111 help 112 Use the fair_share governor as default. This throttles the 113 devices based on their 'contribution' to a zone. The 114 contribution should be provided through platform data. 115 116config THERMAL_DEFAULT_GOV_USER_SPACE 117 bool "user_space" 118 select THERMAL_GOV_USER_SPACE 119 help 120 The Userspace governor allows to get trip point crossed 121 notification from the kernel via uevents. It is recommended 122 to use the netlink interface instead which gives richer 123 information about the thermal framework events. 124 125config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR 126 bool "power_allocator" 127 depends on THERMAL_GOV_POWER_ALLOCATOR 128 help 129 Select this if you want to control temperature based on 130 system and device power allocation. This governor can only 131 operate on cooling devices that implement the power API. 132 133config THERMAL_DEFAULT_GOV_BANG_BANG 134 bool "bang_bang" 135 depends on THERMAL_GOV_BANG_BANG 136 help 137 Use the bang_bang governor as default. This throttles the 138 devices one step at the time, taking into account the trip 139 point hysteresis. 140 141endchoice 142 143config THERMAL_GOV_FAIR_SHARE 144 bool "Fair-share thermal governor" 145 help 146 Enable this to manage platform thermals using fair-share governor. 147 148config THERMAL_GOV_STEP_WISE 149 bool "Step_wise thermal governor" 150 help 151 Enable this to manage platform thermals using a simple linear 152 governor. 153 154config THERMAL_GOV_BANG_BANG 155 bool "Bang Bang thermal governor" 156 default n 157 help 158 Enable this to manage platform thermals using bang bang governor. 159 160 Say 'Y' here if you want to use two point temperature regulation 161 used for fans without throttling. Some fan drivers depend on this 162 governor to be enabled (e.g. acerhdf). 163 164config THERMAL_GOV_USER_SPACE 165 bool "User_space thermal governor" 166 help 167 Enable this to let the user space manage the platform thermals. 168 169config THERMAL_GOV_POWER_ALLOCATOR 170 bool "Power allocator thermal governor" 171 depends on ENERGY_MODEL 172 help 173 Enable this to manage platform thermals by dynamically 174 allocating and limiting power to devices. 175 176config CPU_THERMAL 177 bool "Generic cpu cooling support" 178 depends on THERMAL_OF 179 help 180 Enable the CPU cooling features. If the system has no active 181 cooling device available, this option allows to use the CPU 182 as a cooling device. 183 184if CPU_THERMAL 185 186config CPU_FREQ_THERMAL 187 bool "CPU frequency cooling device" 188 depends on CPU_FREQ 189 default y 190 help 191 This implements the generic cpu cooling mechanism through frequency 192 reduction. An ACPI version of this already exists 193 (drivers/acpi/processor_thermal.c). 194 This will be useful for platforms using the generic thermal interface 195 and not the ACPI interface. 196 197config CPU_IDLE_THERMAL 198 bool "CPU idle cooling device" 199 depends on IDLE_INJECT 200 help 201 This implements the CPU cooling mechanism through 202 idle injection. This will throttle the CPU by injecting 203 idle cycle. 204endif 205 206config DEVFREQ_THERMAL 207 bool "Generic device cooling support" 208 depends on PM_DEVFREQ 209 depends on PM_OPP 210 help 211 This implements the generic devfreq cooling mechanism through 212 frequency reduction for devices using devfreq. 213 214 This will throttle the device by limiting the maximum allowed DVFS 215 frequency corresponding to the cooling level. 216 217 In order to use the power extensions of the cooling device, 218 devfreq should use the simple_ondemand governor. 219 220 If you want this support, you should say Y here. 221 222config THERMAL_EMULATION 223 bool "Thermal emulation mode support" 224 help 225 Enable this option to make a emul_temp sysfs node in thermal zone 226 directory to support temperature emulation. With emulation sysfs node, 227 user can manually input temperature and test the different trip 228 threshold behaviour for simulation purpose. 229 230 WARNING: Be careful while enabling this option on production systems, 231 because userland can easily disable the thermal policy by simply 232 flooding this sysfs node with low temperature values. 233 234config THERMAL_MMIO 235 tristate "Generic Thermal MMIO driver" 236 depends on OF 237 depends on HAS_IOMEM 238 help 239 This option enables the generic thermal MMIO driver that will use 240 memory-mapped reads to get the temperature. Any HW/System that 241 allows temperature reading by a single memory-mapped reading, be it 242 register or shared memory, is a potential candidate to work with this 243 driver. 244 245config HISI_THERMAL 246 tristate "Hisilicon thermal driver" 247 depends on ARCH_HISI || COMPILE_TEST 248 depends on HAS_IOMEM 249 depends on OF 250 default y 251 help 252 Enable this to plug hisilicon's thermal sensor driver into the Linux 253 thermal framework. cpufreq is used as the cooling device to throttle 254 CPUs when the passive trip is crossed. 255 256config IMX_THERMAL 257 tristate "Temperature sensor driver for Freescale i.MX SoCs" 258 depends on ARCH_MXC || COMPILE_TEST 259 depends on NVMEM || !NVMEM 260 depends on MFD_SYSCON 261 depends on OF 262 help 263 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs. 264 It supports one critical trip point and one passive trip point. The 265 cpufreq is used as the cooling device to throttle CPUs when the 266 passive trip is crossed. 267 268config IMX_SC_THERMAL 269 tristate "Temperature sensor driver for NXP i.MX SoCs with System Controller" 270 depends on IMX_SCU 271 depends on OF 272 help 273 Support for Temperature Monitor (TEMPMON) found on NXP i.MX SoCs with 274 system controller inside, Linux kernel has to communicate with system 275 controller via MU (message unit) IPC to get temperature from thermal 276 sensor. It supports one critical trip point and one 277 passive trip point for each thermal sensor. 278 279config IMX8MM_THERMAL 280 tristate "Temperature sensor driver for Freescale i.MX8MM SoC" 281 depends on ARCH_MXC || COMPILE_TEST 282 depends on OF 283 help 284 Support for Thermal Monitoring Unit (TMU) found on Freescale i.MX8MM SoC. 285 It supports one critical trip point and one passive trip point. The 286 cpufreq is used as the cooling device to throttle CPUs when the passive 287 trip is crossed. 288 289config K3_THERMAL 290 tristate "Texas Instruments K3 thermal support" 291 depends on ARCH_K3 || COMPILE_TEST 292 help 293 If you say yes here you get thermal support for the Texas Instruments 294 K3 SoC family. The current chip supported is: 295 - AM654 296 297 This includes temperature reading functionality. 298 299config MAX77620_THERMAL 300 tristate "Temperature sensor driver for Maxim MAX77620 PMIC" 301 depends on MFD_MAX77620 302 depends on OF 303 help 304 Support for die junction temperature warning alarm for Maxim 305 Semiconductor PMIC MAX77620 device. Device generates two alarm 306 interrupts when PMIC die temperature cross the threshold of 307 120 degC and 140 degC. 308 309config QORIQ_THERMAL 310 tristate "QorIQ Thermal Monitoring Unit" 311 depends on THERMAL_OF && HAS_IOMEM 312 depends on PPC_E500MC || SOC_LS1021A || ARCH_LAYERSCAPE || (ARCH_MXC && ARM64) || COMPILE_TEST 313 select REGMAP_MMIO 314 help 315 Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms. 316 It supports one critical trip point and one passive trip point. The 317 cpufreq is used as the cooling device to throttle CPUs when the 318 passive trip is crossed. 319 320config SPEAR_THERMAL 321 tristate "SPEAr thermal sensor driver" 322 depends on PLAT_SPEAR || COMPILE_TEST 323 depends on HAS_IOMEM 324 depends on OF 325 help 326 Enable this to plug the SPEAr thermal sensor driver into the Linux 327 thermal framework. 328 329config SUN8I_THERMAL 330 tristate "Allwinner sun8i thermal driver" 331 depends on ARCH_SUNXI || COMPILE_TEST 332 depends on HAS_IOMEM 333 depends on NVMEM 334 depends on OF 335 depends on RESET_CONTROLLER 336 help 337 Support for the sun8i thermal sensor driver into the Linux thermal 338 framework. 339 340 To compile this driver as a module, choose M here: the 341 module will be called sun8i-thermal. 342 343config ROCKCHIP_THERMAL 344 tristate "Rockchip thermal driver" 345 depends on ARCH_ROCKCHIP || COMPILE_TEST 346 depends on RESET_CONTROLLER 347 depends on HAS_IOMEM 348 help 349 Rockchip thermal driver provides support for Temperature sensor 350 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical 351 trip point. Cpufreq is used as the cooling device and will throttle 352 CPUs when the Temperature crosses the passive trip point. 353 354config RCAR_THERMAL 355 tristate "Renesas R-Car thermal driver" 356 depends on ARCH_RENESAS || COMPILE_TEST 357 depends on HAS_IOMEM 358 help 359 Enable this to plug the R-Car thermal sensor driver into the Linux 360 thermal framework. 361 362config RCAR_GEN3_THERMAL 363 tristate "Renesas R-Car Gen3 and RZ/G2 thermal driver" 364 depends on ARCH_RENESAS || COMPILE_TEST 365 depends on HAS_IOMEM 366 depends on OF 367 help 368 Enable this to plug the R-Car Gen3 or RZ/G2 thermal sensor driver into 369 the Linux thermal framework. 370 371config RZG2L_THERMAL 372 tristate "Renesas RZ/G2L thermal driver" 373 depends on ARCH_RENESAS || COMPILE_TEST 374 depends on HAS_IOMEM 375 depends on OF 376 help 377 Enable this to plug the RZ/G2L thermal sensor driver into the Linux 378 thermal framework. 379 380config KIRKWOOD_THERMAL 381 tristate "Temperature sensor on Marvell Kirkwood SoCs" 382 depends on MACH_KIRKWOOD || COMPILE_TEST 383 depends on HAS_IOMEM 384 depends on OF 385 help 386 Support for the Kirkwood thermal sensor driver into the Linux thermal 387 framework. Only kirkwood 88F6282 and 88F6283 have this sensor. 388 389config DOVE_THERMAL 390 tristate "Temperature sensor on Marvell Dove SoCs" 391 depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST 392 depends on HAS_IOMEM 393 depends on OF 394 help 395 Support for the Dove thermal sensor driver in the Linux thermal 396 framework. 397 398config DB8500_THERMAL 399 tristate "DB8500 thermal management" 400 depends on MFD_DB8500_PRCMU && OF 401 default y 402 help 403 Adds DB8500 thermal management implementation according to the thermal 404 management framework. A thermal zone with several trip points will be 405 created. Cooling devices can be bound to the trip points to cool this 406 thermal zone if trip points reached. 407 408config ARMADA_THERMAL 409 tristate "Marvell EBU Armada SoCs thermal management" 410 depends on ARCH_MVEBU || COMPILE_TEST 411 depends on HAS_IOMEM 412 depends on OF 413 help 414 Enable this option if you want to have support for thermal management 415 controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K). 416 417config DA9062_THERMAL 418 tristate "DA9062/DA9061 Dialog Semiconductor thermal driver" 419 depends on MFD_DA9062 || COMPILE_TEST 420 depends on OF 421 help 422 Enable this for the Dialog Semiconductor thermal sensor driver. 423 This will report PMIC junction over-temperature for one thermal trip 424 zone. 425 Compatible with the DA9062 and DA9061 PMICs. 426 427menu "Mediatek thermal drivers" 428depends on ARCH_MEDIATEK || COMPILE_TEST 429source "drivers/thermal/mediatek/Kconfig" 430endmenu 431 432config AMLOGIC_THERMAL 433 tristate "Amlogic Thermal Support" 434 default ARCH_MESON 435 depends on OF && ARCH_MESON 436 help 437 If you say yes here you get support for Amlogic Thermal 438 for G12 SoC Family. 439 440 This driver can also be built as a module. If so, the module will 441 be called amlogic_thermal. 442 443menu "Intel thermal drivers" 444depends on X86 || X86_INTEL_QUARK || COMPILE_TEST 445source "drivers/thermal/intel/Kconfig" 446endmenu 447 448menu "Broadcom thermal drivers" 449depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \ 450 COMPILE_TEST 451source "drivers/thermal/broadcom/Kconfig" 452endmenu 453 454menu "Texas Instruments thermal drivers" 455depends on ARCH_HAS_BANDGAP || COMPILE_TEST 456depends on HAS_IOMEM 457source "drivers/thermal/ti-soc-thermal/Kconfig" 458endmenu 459 460menu "Samsung thermal drivers" 461depends on ARCH_EXYNOS || COMPILE_TEST 462source "drivers/thermal/samsung/Kconfig" 463endmenu 464 465menu "STMicroelectronics thermal drivers" 466depends on (ARCH_STI || ARCH_STM32) && OF 467source "drivers/thermal/st/Kconfig" 468endmenu 469 470source "drivers/thermal/tegra/Kconfig" 471 472config GENERIC_ADC_THERMAL 473 tristate "Generic ADC based thermal sensor" 474 depends on IIO 475 help 476 This enabled a thermal sysfs driver for the temperature sensor 477 which is connected to the General Purpose ADC. The ADC channel 478 is read via IIO framework and the channel information is provided 479 to this driver. This driver reports the temperature by reading ADC 480 channel and converts it to temperature based on lookup table. 481 482menu "Qualcomm thermal drivers" 483depends on (ARCH_QCOM && OF) || COMPILE_TEST 484source "drivers/thermal/qcom/Kconfig" 485endmenu 486 487config UNIPHIER_THERMAL 488 tristate "Socionext UniPhier thermal driver" 489 depends on ARCH_UNIPHIER || COMPILE_TEST 490 depends on THERMAL_OF && MFD_SYSCON 491 help 492 Enable this to plug in UniPhier on-chip PVT thermal driver into the 493 thermal framework. The driver supports CPU thermal zone temperature 494 reporting and a couple of trip points. 495 496config SPRD_THERMAL 497 tristate "Temperature sensor on Spreadtrum SoCs" 498 depends on ARCH_SPRD || COMPILE_TEST 499 help 500 Support for the Spreadtrum thermal sensor driver in the Linux thermal 501 framework. 502 503config KHADAS_MCU_FAN_THERMAL 504 tristate "Khadas MCU controller FAN cooling support" 505 depends on OF 506 depends on MFD_KHADAS_MCU 507 select MFD_CORE 508 select REGMAP 509 help 510 If you say yes here you get support for the FAN controlled 511 by the Microcontroller found on the Khadas VIM boards. 512 513config LOONGSON2_THERMAL 514 tristate "Loongson-2 SoC series thermal driver" 515 depends on LOONGARCH || COMPILE_TEST 516 depends on OF 517 help 518 Support for Thermal driver found on Loongson-2 SoC series platforms. 519 The thermal driver realizes get_temp and set_trips function, which 520 are used to obtain the temperature of the current node and set the 521 temperature range to trigger the interrupt. When the input temperature 522 is higher than the high temperature threshold or lower than the low 523 temperature threshold, the interrupt will occur. 524 525endif 526