History log of /openbmc/linux/include/dt-bindings/thermal/thermal.h (Results 51 – 75 of 75)
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# 794c3a0a 06-Jan-2015 Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Merge branches 'acpi-pm', 'acpi-processor' and 'acpi-video'

* acpi-pm:
ACPI / PM: Fix PM initialization for devices that are not present

* acpi-processor:
ACPI / processor: Rename acpi_(un)map_

Merge branches 'acpi-pm', 'acpi-processor' and 'acpi-video'

* acpi-pm:
ACPI / PM: Fix PM initialization for devices that are not present

* acpi-processor:
ACPI / processor: Rename acpi_(un)map_lsapic() to acpi_(un)map_cpu()
ACPI / processor: Convert apic_id to phys_id to make it arch agnostic

* acpi-video:
ACPI / video: Add disable_native_backlight quirk for Dell XPS15 L521X

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Revision tags: v3.19-rc3
# 4c5d4995 29-Dec-2014 Linus Torvalds <torvalds@linux-foundation.org>

Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux

Pull thermal management updates from Zhang Rui:
"First of all, the most important change is the thermal cpu cooling

Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux

Pull thermal management updates from Zhang Rui:
"First of all, the most important change is the thermal cpu cooling
fixes. The major fix here is to have proper sequencing between
cpufreq layer and thermal cpu cooling registration. A take away of
this fix is an improvement in the thermal drivers code. Thermal
drivers that require cpu cooling do not need to check for cpufreq
layer. The requirement now is to propagate the error code, if any,
while registering cpu cooling device. Thanks to Viresh for
implementing the required CPUfreq changes.

Second, a new driver is introduced for int340x processor thermal
device. Given that int340x thermal is disabled by default, and this
processor thermal device is only available on limited platforms, plus
the driver does nothing but exposes some thermal limitation
information for user space to use, thus I think it is safe to include
it in this pull request after missing 3.19-rc2.

Specifics:

- Thermal cpu cooling fixes and cleanups.

- introduce INT340X processor thermal reporting device driver.

- several small fixes and cleanups for int340x thermal drivers"

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (43 commits)
Thermal/int340x/int3403: Free acpi notification handler
Thermal/int340x/processor_thermal: Fix memory leak
Thermal/int340x/int3403: Fix memory leak
thermal: int340x: Introduce processor reporting device
thermal: int340x_thermal: drop owner assignment from platform_drivers
thermal: drop owner assignment from platform_drivers
thermal: cpu_cooling: document node in struct cpufreq_cooling_device
thermal/powerclamp: add ids for future xeon cpus
Thermal/int340x: Handle properly the case when _trt or _art acpi entry is missing
thermal: cpu_cooling: return ERR_PTR() for !CPU_THERMAL or !THERMAL_OF
thermal: cpu_cooling: small memory leak on error
thermal: ti-soc-thermal: Do not print error message in the EPROBE_DEFER case
thermal: db8500: Do not print error message in the EPROBE_DEFER case
thermal: imx: Do not print error message in the EPROBE_DEFER case
thermal: Fix cdev registration with THERMAL_NO_LIMIT on 64bit
drivers: thermal: Remove ARCH_HAS_BANDGAP dependency for samsung
thermal:core:fix: Check return code of the ->get_max_state() callback
thermal: cpu_cooling: update copyright tags
thermal: cpu_cooling: Use cpufreq_dev->freq_table for finding level/freq
thermal: cpu_cooling: Store frequencies in descending order
...

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Revision tags: v3.19-rc2
# 7429b1e0 23-Dec-2014 Zhang Rui <rui.zhang@intel.com>

Merge branches 'thermal-core', 'thermal-soc' and 'thermal-int340x' of .git into next


# 32c9edc4 21-Dec-2014 Zhang Rui <rui.zhang@intel.com>

Merge branch 'fixes' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc


Revision tags: v3.19-rc1
# a940cb34 09-Dec-2014 Punit Agrawal <punit.agrawal@arm.com>

thermal: Fix cdev registration with THERMAL_NO_LIMIT on 64bit

The size of unsigned long varies between 32 and 64 bit systems while
the size of phandle arguments is always 32 bits per parameter.

On

thermal: Fix cdev registration with THERMAL_NO_LIMIT on 64bit

The size of unsigned long varies between 32 and 64 bit systems while
the size of phandle arguments is always 32 bits per parameter.

On 64-bit systems, cooling devices registered via of-thermal apis fail
to bind when the min/max cooling state is specified as
THERMAL_NO_LIMIT (-1UL) as there is a mis-match between the value read
from the device tree (32bit) and the pre-processor define (64bit).

As we're unlikely to need cooling states larger than 32 bits, and for
consistency with the size of phandle arguments, explicitly limit
THERMAL_NO_LIMIT to 32 bits.

Reported-by: Hyungwoo Yang <hwoo.yang@gmail.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

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Revision tags: v3.18, v3.18-rc7, v3.18-rc6, v3.18-rc5, v3.18-rc4, v3.18-rc3, v3.18-rc2, v3.18-rc1, v3.17, v3.17-rc7, v3.17-rc6, v3.17-rc5, v3.17-rc4, v3.17-rc3, v3.17-rc2, v3.17-rc1, v3.16, v3.16-rc7, v3.16-rc6, v3.16-rc5, v3.16-rc4, v3.16-rc3, v3.16-rc2, v3.16-rc1, v3.15, v3.15-rc8, v3.15-rc7, v3.15-rc6, v3.15-rc5, v3.15-rc4, v3.15-rc3, v3.15-rc2
# ecd740c6 13-Apr-2014 James Morris <james.l.morris@oracle.com>

Merge commit 'v3.14' into next


Revision tags: v3.15-rc1
# 6d32c850 31-Mar-2014 Paul Moore <pmoore@redhat.com>

Merge tag 'v3.14' into next

Linux 3.14


# 692d9655 03-Apr-2014 Dmitry Torokhov <dmitry.torokhov@gmail.com>

Merge branch 'next' into for-linus

First round of input updates for 3.15.


Revision tags: v3.14, v3.14-rc8
# e19b9137 18-Mar-2014 Daniel Vetter <daniel.vetter@ffwll.ch>

Merge remote-tracking branch 'airlied/drm-next' into drm-intel-next

Conflicts:
drivers/gpu/drm/i915/Makefile

Makefile cleanup in drm-intel-next conflicts with a build-fix to move
intel_opregion un

Merge remote-tracking branch 'airlied/drm-next' into drm-intel-next

Conflicts:
drivers/gpu/drm/i915/Makefile

Makefile cleanup in drm-intel-next conflicts with a build-fix to move
intel_opregion under CONFIG_ACPI.

Signed-off-by: Daniel Vetter <daniel.vetter@ffwll.ch>

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Revision tags: v3.14-rc7
# e8e6e601 10-Mar-2014 Daniel Vetter <daniel.vetter@ffwll.ch>

Merge tag 'v3.14-rc6' into drm-intel-next-queued

Linux 3.14-rc6

I need the hdmi/dvi-dual link fixes in 3.14 to avoid ugly conflicts
when merging Ville's new hdmi cloning support into my -next tree

Merge tag 'v3.14-rc6' into drm-intel-next-queued

Linux 3.14-rc6

I need the hdmi/dvi-dual link fixes in 3.14 to avoid ugly conflicts
when merging Ville's new hdmi cloning support into my -next tree

Conflicts:
drivers/gpu/drm/i915/Makefile
drivers/gpu/drm/i915/intel_dp.c

Makefile cleanup conflicts with an acpi build fix, intel_dp.c is
trivial.

Signed-off-by: Daniel Vetter <daniel.vetter@ffwll.ch>

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Revision tags: v3.14-rc6
# d083f580 06-Mar-2014 Mark Brown <broonie@linaro.org>

Merge tag 'parse-val' of git://git.kernel.org/pub/scm/linux/kernel/git/broonie/regmap into asoc-core

regmap: Add parse_val() API

This is useful for generic code built on top of regmap dealing with

Merge tag 'parse-val' of git://git.kernel.org/pub/scm/linux/kernel/git/broonie/regmap into asoc-core

regmap: Add parse_val() API

This is useful for generic code built on top of regmap dealing with
blocks of data.

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Revision tags: v3.14-rc5
# 04421fe2 01-Mar-2014 Dmitry Torokhov <dmitry.torokhov@gmail.com>

Merge tag 'v3.14-rc4' into next

Merge with Linux 3.14-rc4 to bring devm_request_any_context_irq().


# b3fdfc1b 24-Feb-2014 Chris Zankel <chris@zankel.net>

Merge tag 'xtensa-for-next-20140221-1' into for_next

Xtensa fixes for 3.14:
- allow booting xtfpga on boards with new uBoot and >128MBytes memory;
- drop nonexistent GPIO32 support from fsf variant;

Merge tag 'xtensa-for-next-20140221-1' into for_next

Xtensa fixes for 3.14:
- allow booting xtfpga on boards with new uBoot and >128MBytes memory;
- drop nonexistent GPIO32 support from fsf variant;
- don't select USE_GENERIC_SMP_HELPERS;
- enable common clock framework support, set up ethoc clock on xtfpga;
- wire up sched_setattr and sched_getattr syscalls.

Signed-off-by: Chris Zankel <chris@zankel.net>

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Revision tags: v3.14-rc4
# d4263348 20-Feb-2014 Jiri Kosina <jkosina@suse.cz>

Merge branch 'master' into for-next


Revision tags: v3.14-rc3, v3.14-rc2
# 3c3d7cb1 09-Feb-2014 Ingo Molnar <mingo@kernel.org>

Merge branch 'linus' into perf/core

Refresh the branch to a v3.14-rc base before queueing up new devel patches.

Signed-off-by: Ingo Molnar <mingo@kernel.org>


# a3b072cd 07-Feb-2014 H. Peter Anvin <hpa@linux.intel.com>

Merge tag 'efi-urgent' into x86/urgent

* Avoid WARN_ON() when mapping BGRT on Baytrail (EFI 32-bit).

Signed-off-by: H. Peter Anvin <hpa@linux.intel.com>


# 6ceb3391 04-Feb-2014 Kalle Valo <kvalo@qca.qualcomm.com>

Merge remote-tracking branch 'wireless-next/master' into ath-next


# c29b8f31 03-Feb-2014 Mauro Carvalho Chehab <m.chehab@samsung.com>

Merge tag 'v3.14-rc1' into patchwork

Linus 3.14-rc1

* tag 'v3.14-rc1': (11781 commits)
Linus 3.14-rc1
hpfs: optimize quad buffer loading
hpfs: remember free space
parisc: add flexible mmap

Merge tag 'v3.14-rc1' into patchwork

Linus 3.14-rc1

* tag 'v3.14-rc1': (11781 commits)
Linus 3.14-rc1
hpfs: optimize quad buffer loading
hpfs: remember free space
parisc: add flexible mmap memory layout support
parisc: Make EWOULDBLOCK be equal to EAGAIN on parisc
parisc: convert uapi/asm/stat.h to use native types only
parisc: wire up sched_setattr and sched_getattr
parisc: fix cache-flushing
parisc/sti_console: prefer Linux fonts over built-in ROM fonts
hwmon: Fix SENSORS_TMP102 dependencies to eliminate build errors
hwmon: Fix SENSORS_LM75 dependencies to eliminate build errors
tools/power turbostat: introduce -s to dump counters
tools/power turbostat: remove unused command line option
afs: proc cells and rootcell are writeable
tile: remove compat_sys_lookup_dcookie declaration to fix compile error
Revert "PCI: Remove from bus_list and release resources in pci_release_dev()"
ARM: multi_v7_defconfig: remove redundant entries and re-enable TI_EDMA
ARM: multi_v7_defconfig: add mvebu drivers
clocksource: kona: Add basic use of external clock
drivers: bus: fix CCI driver kcalloc call parameters swap
...

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Revision tags: v3.14-rc1
# eaa4e4fc 02-Feb-2014 Ingo Molnar <mingo@kernel.org>

Merge branch 'linus' into sched/core, to resolve conflicts

Conflicts:
kernel/sysctl.c

Signed-off-by: Ingo Molnar <mingo@kernel.org>


# 65370bdf 02-Feb-2014 Ingo Molnar <mingo@kernel.org>

Merge branch 'linus' into core/locking

Refresh the topic.

Signed-off-by: Ingo Molnar <mingo@kernel.org>


# cc11f372 27-Jan-2014 Greg Kroah-Hartman <gregkh@linuxfoundation.org>

Merge branch 'master' into staging-next

We need the network changes in staging-next in order to be able to fix
up the rtl8821ae driver to build properly.

Signed-off-by: Greg Kroah-Hartman <gregkh@l

Merge branch 'master' into staging-next

We need the network changes in staging-next in order to be able to fix
up the rtl8821ae driver to build properly.

Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>

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# 91466574 24-Jan-2014 Linus Torvalds <torvalds@linux-foundation.org>

Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux

Pull thermal management updates from Zhang Rui:
"This time, the biggest change is the work of representing hardware

Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux

Pull thermal management updates from Zhang Rui:
"This time, the biggest change is the work of representing hardware
thermal properties in device tree infrastructure.

This work includes the introduction of a device tree bindings for
describing the hardware thermal behavior and limits, and also a parser
to read and interpret the data, and build thermal zones and thermal
binding parameters. It also contains three examples on how to use the
new representation on sensor devices, using three different drivers to
accomplish it. One driver is in thermal subsystem, the TI SoC
thermal, and the other two drivers are in hwmon subsystem.

Actually, this would be the first step of the complete work because we
still need to check other potential drivers to be converted and then
validate the proposed API. But the reason why I include it in this
pull request is that, first, this change does not hurt any others
without using this approach, second, the principle and concept of this
change would not break after converting the remaining drivers. BTW,
as you can see, there are several points in this change that do not
belong to thermal subsystem. Because it has been suggested by Guenter
R that in such cases, it is recommended to send the complete series
via one single subsystem.

Specifics:

- representing hardware thermal properties in device tree
infrastructure

- fix a regression that the imx thermal driver breaks system suspend.

- introduce ACPI INT3403 thermal driver to retrieve temperature data
from the INT3403 ACPI device object present on some systems.

- introduce debug statement for thermal core and step_wise governor.

- assorted fixes and cleanups for thermal core, cpu cooling, exynos
thrmal, intel powerclamp and imx thermal driver"

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (34 commits)
thermal: remove const flag from .ops of imx thermal
Thermal: update thermal zone device after setting emul_temp
intel_powerclamp: Fix cstate counter detection.
thermal: imx: add necessary clk operation
Thermal cpu cooling: return error if no valid cpu frequency entry
thermal: fix cpu_cooling max_level behavior
thermal: rcar-thermal: Enable driver compilation with COMPILE_TEST
thermal: debug: add debug statement for core and step_wise
thermal: imx_thermal: add module device table
drivers: thermal: Mark function as static in x86_pkg_temp_thermal.c
thermal:samsung: fix compilation warning
thermal: imx: correct suspend/resume flow
thermal: exynos: fix error return code
Thermal: ACPI INT3403 thermal driver
MAINTAINERS: add thermal bindings entry in thermal domain
arm: dts: make OMAP4460 bandgap node to belong to OCP
arm: dts: make OMAP443x bandgap node to belong to OCP
arm: dts: add cooling properties on omap5 cpu node
arm: dts: add omap5 thermal data
arm: dts: add omap5 CORE thermal data
...

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Revision tags: v3.13, v3.13-rc8, v3.13-rc7
# 201531c2 02-Jan-2014 Zhang Rui <rui.zhang@intel.com>

Merge branches 'misc', 'soc', 'soc-eduardo' and 'int3404-thermal' of .git into next


# c1b7bac5 01-Jan-2014 Zhang Rui <rui.zhang@intel.com>

Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into soc-thermal


Revision tags: v3.13-rc6, v3.13-rc5, v3.13-rc4, v3.13-rc3, v3.13-rc2, v3.13-rc1, v3.12, v3.12-rc7, v3.12-rc6, v3.12-rc5, v3.12-rc4, v3.12-rc3, v3.12-rc2, v3.12-rc1, v3.11, v3.11-rc7, v3.11-rc6, v3.11-rc5, v3.11-rc4, v3.11-rc3, v3.11-rc2, v3.11-rc1
# 4e5e4705 03-Jul-2013 Eduardo Valentin <eduardo.valentin@ti.com>

thermal: introduce device tree parser

This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it i

thermal: introduce device tree parser

This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it in the thermal framework is presented.

This patch introduces a thermal data parser for device
tree. The parsed data is used to build thermal zones
and thermal binding parameters. The output data
can then be used to deploy thermal policies.

This patch adds also documentation regarding this
API and how to define tree nodes to use
this infrastructure.

Note that, in order to be able to have control
on the sensor registration on the DT thermal zone,
it was required to allow changing the thermal zone
.get_temp callback. For this reason, this patch
also removes the 'const' modifier from the .ops
field of thermal zone devices.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

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