#
794c3a0a |
| 06-Jan-2015 |
Rafael J. Wysocki <rafael.j.wysocki@intel.com> |
Merge branches 'acpi-pm', 'acpi-processor' and 'acpi-video'
* acpi-pm: ACPI / PM: Fix PM initialization for devices that are not present
* acpi-processor: ACPI / processor: Rename acpi_(un)map_
Merge branches 'acpi-pm', 'acpi-processor' and 'acpi-video'
* acpi-pm: ACPI / PM: Fix PM initialization for devices that are not present
* acpi-processor: ACPI / processor: Rename acpi_(un)map_lsapic() to acpi_(un)map_cpu() ACPI / processor: Convert apic_id to phys_id to make it arch agnostic
* acpi-video: ACPI / video: Add disable_native_backlight quirk for Dell XPS15 L521X
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Revision tags: v3.19-rc3 |
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#
4c5d4995 |
| 29-Dec-2014 |
Linus Torvalds <torvalds@linux-foundation.org> |
Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui: "First of all, the most important change is the thermal cpu cooling
Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui: "First of all, the most important change is the thermal cpu cooling fixes. The major fix here is to have proper sequencing between cpufreq layer and thermal cpu cooling registration. A take away of this fix is an improvement in the thermal drivers code. Thermal drivers that require cpu cooling do not need to check for cpufreq layer. The requirement now is to propagate the error code, if any, while registering cpu cooling device. Thanks to Viresh for implementing the required CPUfreq changes.
Second, a new driver is introduced for int340x processor thermal device. Given that int340x thermal is disabled by default, and this processor thermal device is only available on limited platforms, plus the driver does nothing but exposes some thermal limitation information for user space to use, thus I think it is safe to include it in this pull request after missing 3.19-rc2.
Specifics:
- Thermal cpu cooling fixes and cleanups.
- introduce INT340X processor thermal reporting device driver.
- several small fixes and cleanups for int340x thermal drivers"
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (43 commits) Thermal/int340x/int3403: Free acpi notification handler Thermal/int340x/processor_thermal: Fix memory leak Thermal/int340x/int3403: Fix memory leak thermal: int340x: Introduce processor reporting device thermal: int340x_thermal: drop owner assignment from platform_drivers thermal: drop owner assignment from platform_drivers thermal: cpu_cooling: document node in struct cpufreq_cooling_device thermal/powerclamp: add ids for future xeon cpus Thermal/int340x: Handle properly the case when _trt or _art acpi entry is missing thermal: cpu_cooling: return ERR_PTR() for !CPU_THERMAL or !THERMAL_OF thermal: cpu_cooling: small memory leak on error thermal: ti-soc-thermal: Do not print error message in the EPROBE_DEFER case thermal: db8500: Do not print error message in the EPROBE_DEFER case thermal: imx: Do not print error message in the EPROBE_DEFER case thermal: Fix cdev registration with THERMAL_NO_LIMIT on 64bit drivers: thermal: Remove ARCH_HAS_BANDGAP dependency for samsung thermal:core:fix: Check return code of the ->get_max_state() callback thermal: cpu_cooling: update copyright tags thermal: cpu_cooling: Use cpufreq_dev->freq_table for finding level/freq thermal: cpu_cooling: Store frequencies in descending order ...
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Revision tags: v3.19-rc2 |
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#
7429b1e0 |
| 23-Dec-2014 |
Zhang Rui <rui.zhang@intel.com> |
Merge branches 'thermal-core', 'thermal-soc' and 'thermal-int340x' of .git into next
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#
32c9edc4 |
| 21-Dec-2014 |
Zhang Rui <rui.zhang@intel.com> |
Merge branch 'fixes' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc
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Revision tags: v3.19-rc1 |
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#
a940cb34 |
| 09-Dec-2014 |
Punit Agrawal <punit.agrawal@arm.com> |
thermal: Fix cdev registration with THERMAL_NO_LIMIT on 64bit
The size of unsigned long varies between 32 and 64 bit systems while the size of phandle arguments is always 32 bits per parameter.
On
thermal: Fix cdev registration with THERMAL_NO_LIMIT on 64bit
The size of unsigned long varies between 32 and 64 bit systems while the size of phandle arguments is always 32 bits per parameter.
On 64-bit systems, cooling devices registered via of-thermal apis fail to bind when the min/max cooling state is specified as THERMAL_NO_LIMIT (-1UL) as there is a mis-match between the value read from the device tree (32bit) and the pre-processor define (64bit).
As we're unlikely to need cooling states larger than 32 bits, and for consistency with the size of phandle arguments, explicitly limit THERMAL_NO_LIMIT to 32 bits.
Reported-by: Hyungwoo Yang <hwoo.yang@gmail.com> Acked-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Revision tags: v3.18, v3.18-rc7, v3.18-rc6, v3.18-rc5, v3.18-rc4, v3.18-rc3, v3.18-rc2, v3.18-rc1, v3.17, v3.17-rc7, v3.17-rc6, v3.17-rc5, v3.17-rc4, v3.17-rc3, v3.17-rc2, v3.17-rc1, v3.16, v3.16-rc7, v3.16-rc6, v3.16-rc5, v3.16-rc4, v3.16-rc3, v3.16-rc2, v3.16-rc1, v3.15, v3.15-rc8, v3.15-rc7, v3.15-rc6, v3.15-rc5, v3.15-rc4, v3.15-rc3, v3.15-rc2 |
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#
ecd740c6 |
| 13-Apr-2014 |
James Morris <james.l.morris@oracle.com> |
Merge commit 'v3.14' into next
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Revision tags: v3.15-rc1 |
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#
6d32c850 |
| 31-Mar-2014 |
Paul Moore <pmoore@redhat.com> |
Merge tag 'v3.14' into next
Linux 3.14
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#
692d9655 |
| 03-Apr-2014 |
Dmitry Torokhov <dmitry.torokhov@gmail.com> |
Merge branch 'next' into for-linus
First round of input updates for 3.15.
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Revision tags: v3.14, v3.14-rc8 |
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#
e19b9137 |
| 18-Mar-2014 |
Daniel Vetter <daniel.vetter@ffwll.ch> |
Merge remote-tracking branch 'airlied/drm-next' into drm-intel-next
Conflicts: drivers/gpu/drm/i915/Makefile
Makefile cleanup in drm-intel-next conflicts with a build-fix to move intel_opregion un
Merge remote-tracking branch 'airlied/drm-next' into drm-intel-next
Conflicts: drivers/gpu/drm/i915/Makefile
Makefile cleanup in drm-intel-next conflicts with a build-fix to move intel_opregion under CONFIG_ACPI.
Signed-off-by: Daniel Vetter <daniel.vetter@ffwll.ch>
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Revision tags: v3.14-rc7 |
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#
e8e6e601 |
| 10-Mar-2014 |
Daniel Vetter <daniel.vetter@ffwll.ch> |
Merge tag 'v3.14-rc6' into drm-intel-next-queued
Linux 3.14-rc6
I need the hdmi/dvi-dual link fixes in 3.14 to avoid ugly conflicts when merging Ville's new hdmi cloning support into my -next tree
Merge tag 'v3.14-rc6' into drm-intel-next-queued
Linux 3.14-rc6
I need the hdmi/dvi-dual link fixes in 3.14 to avoid ugly conflicts when merging Ville's new hdmi cloning support into my -next tree
Conflicts: drivers/gpu/drm/i915/Makefile drivers/gpu/drm/i915/intel_dp.c
Makefile cleanup conflicts with an acpi build fix, intel_dp.c is trivial.
Signed-off-by: Daniel Vetter <daniel.vetter@ffwll.ch>
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Revision tags: v3.14-rc6 |
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#
d083f580 |
| 06-Mar-2014 |
Mark Brown <broonie@linaro.org> |
Merge tag 'parse-val' of git://git.kernel.org/pub/scm/linux/kernel/git/broonie/regmap into asoc-core
regmap: Add parse_val() API
This is useful for generic code built on top of regmap dealing with
Merge tag 'parse-val' of git://git.kernel.org/pub/scm/linux/kernel/git/broonie/regmap into asoc-core
regmap: Add parse_val() API
This is useful for generic code built on top of regmap dealing with blocks of data.
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Revision tags: v3.14-rc5 |
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#
04421fe2 |
| 01-Mar-2014 |
Dmitry Torokhov <dmitry.torokhov@gmail.com> |
Merge tag 'v3.14-rc4' into next
Merge with Linux 3.14-rc4 to bring devm_request_any_context_irq().
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#
b3fdfc1b |
| 24-Feb-2014 |
Chris Zankel <chris@zankel.net> |
Merge tag 'xtensa-for-next-20140221-1' into for_next
Xtensa fixes for 3.14: - allow booting xtfpga on boards with new uBoot and >128MBytes memory; - drop nonexistent GPIO32 support from fsf variant;
Merge tag 'xtensa-for-next-20140221-1' into for_next
Xtensa fixes for 3.14: - allow booting xtfpga on boards with new uBoot and >128MBytes memory; - drop nonexistent GPIO32 support from fsf variant; - don't select USE_GENERIC_SMP_HELPERS; - enable common clock framework support, set up ethoc clock on xtfpga; - wire up sched_setattr and sched_getattr syscalls.
Signed-off-by: Chris Zankel <chris@zankel.net>
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Revision tags: v3.14-rc4 |
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#
d4263348 |
| 20-Feb-2014 |
Jiri Kosina <jkosina@suse.cz> |
Merge branch 'master' into for-next
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Revision tags: v3.14-rc3, v3.14-rc2 |
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#
3c3d7cb1 |
| 09-Feb-2014 |
Ingo Molnar <mingo@kernel.org> |
Merge branch 'linus' into perf/core
Refresh the branch to a v3.14-rc base before queueing up new devel patches.
Signed-off-by: Ingo Molnar <mingo@kernel.org>
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a3b072cd |
| 07-Feb-2014 |
H. Peter Anvin <hpa@linux.intel.com> |
Merge tag 'efi-urgent' into x86/urgent
* Avoid WARN_ON() when mapping BGRT on Baytrail (EFI 32-bit).
Signed-off-by: H. Peter Anvin <hpa@linux.intel.com>
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6ceb3391 |
| 04-Feb-2014 |
Kalle Valo <kvalo@qca.qualcomm.com> |
Merge remote-tracking branch 'wireless-next/master' into ath-next
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c29b8f31 |
| 03-Feb-2014 |
Mauro Carvalho Chehab <m.chehab@samsung.com> |
Merge tag 'v3.14-rc1' into patchwork
Linus 3.14-rc1
* tag 'v3.14-rc1': (11781 commits) Linus 3.14-rc1 hpfs: optimize quad buffer loading hpfs: remember free space parisc: add flexible mmap
Merge tag 'v3.14-rc1' into patchwork
Linus 3.14-rc1
* tag 'v3.14-rc1': (11781 commits) Linus 3.14-rc1 hpfs: optimize quad buffer loading hpfs: remember free space parisc: add flexible mmap memory layout support parisc: Make EWOULDBLOCK be equal to EAGAIN on parisc parisc: convert uapi/asm/stat.h to use native types only parisc: wire up sched_setattr and sched_getattr parisc: fix cache-flushing parisc/sti_console: prefer Linux fonts over built-in ROM fonts hwmon: Fix SENSORS_TMP102 dependencies to eliminate build errors hwmon: Fix SENSORS_LM75 dependencies to eliminate build errors tools/power turbostat: introduce -s to dump counters tools/power turbostat: remove unused command line option afs: proc cells and rootcell are writeable tile: remove compat_sys_lookup_dcookie declaration to fix compile error Revert "PCI: Remove from bus_list and release resources in pci_release_dev()" ARM: multi_v7_defconfig: remove redundant entries and re-enable TI_EDMA ARM: multi_v7_defconfig: add mvebu drivers clocksource: kona: Add basic use of external clock drivers: bus: fix CCI driver kcalloc call parameters swap ...
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Revision tags: v3.14-rc1 |
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#
eaa4e4fc |
| 02-Feb-2014 |
Ingo Molnar <mingo@kernel.org> |
Merge branch 'linus' into sched/core, to resolve conflicts
Conflicts: kernel/sysctl.c
Signed-off-by: Ingo Molnar <mingo@kernel.org>
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65370bdf |
| 02-Feb-2014 |
Ingo Molnar <mingo@kernel.org> |
Merge branch 'linus' into core/locking
Refresh the topic.
Signed-off-by: Ingo Molnar <mingo@kernel.org>
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#
cc11f372 |
| 27-Jan-2014 |
Greg Kroah-Hartman <gregkh@linuxfoundation.org> |
Merge branch 'master' into staging-next
We need the network changes in staging-next in order to be able to fix up the rtl8821ae driver to build properly.
Signed-off-by: Greg Kroah-Hartman <gregkh@l
Merge branch 'master' into staging-next
We need the network changes in staging-next in order to be able to fix up the rtl8821ae driver to build properly.
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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#
91466574 |
| 24-Jan-2014 |
Linus Torvalds <torvalds@linux-foundation.org> |
Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui: "This time, the biggest change is the work of representing hardware
Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui: "This time, the biggest change is the work of representing hardware thermal properties in device tree infrastructure.
This work includes the introduction of a device tree bindings for describing the hardware thermal behavior and limits, and also a parser to read and interpret the data, and build thermal zones and thermal binding parameters. It also contains three examples on how to use the new representation on sensor devices, using three different drivers to accomplish it. One driver is in thermal subsystem, the TI SoC thermal, and the other two drivers are in hwmon subsystem.
Actually, this would be the first step of the complete work because we still need to check other potential drivers to be converted and then validate the proposed API. But the reason why I include it in this pull request is that, first, this change does not hurt any others without using this approach, second, the principle and concept of this change would not break after converting the remaining drivers. BTW, as you can see, there are several points in this change that do not belong to thermal subsystem. Because it has been suggested by Guenter R that in such cases, it is recommended to send the complete series via one single subsystem.
Specifics:
- representing hardware thermal properties in device tree infrastructure
- fix a regression that the imx thermal driver breaks system suspend.
- introduce ACPI INT3403 thermal driver to retrieve temperature data from the INT3403 ACPI device object present on some systems.
- introduce debug statement for thermal core and step_wise governor.
- assorted fixes and cleanups for thermal core, cpu cooling, exynos thrmal, intel powerclamp and imx thermal driver"
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (34 commits) thermal: remove const flag from .ops of imx thermal Thermal: update thermal zone device after setting emul_temp intel_powerclamp: Fix cstate counter detection. thermal: imx: add necessary clk operation Thermal cpu cooling: return error if no valid cpu frequency entry thermal: fix cpu_cooling max_level behavior thermal: rcar-thermal: Enable driver compilation with COMPILE_TEST thermal: debug: add debug statement for core and step_wise thermal: imx_thermal: add module device table drivers: thermal: Mark function as static in x86_pkg_temp_thermal.c thermal:samsung: fix compilation warning thermal: imx: correct suspend/resume flow thermal: exynos: fix error return code Thermal: ACPI INT3403 thermal driver MAINTAINERS: add thermal bindings entry in thermal domain arm: dts: make OMAP4460 bandgap node to belong to OCP arm: dts: make OMAP443x bandgap node to belong to OCP arm: dts: add cooling properties on omap5 cpu node arm: dts: add omap5 thermal data arm: dts: add omap5 CORE thermal data ...
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Revision tags: v3.13, v3.13-rc8, v3.13-rc7 |
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#
201531c2 |
| 02-Jan-2014 |
Zhang Rui <rui.zhang@intel.com> |
Merge branches 'misc', 'soc', 'soc-eduardo' and 'int3404-thermal' of .git into next
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#
c1b7bac5 |
| 01-Jan-2014 |
Zhang Rui <rui.zhang@intel.com> |
Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into soc-thermal
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Revision tags: v3.13-rc6, v3.13-rc5, v3.13-rc4, v3.13-rc3, v3.13-rc2, v3.13-rc1, v3.12, v3.12-rc7, v3.12-rc6, v3.12-rc5, v3.12-rc4, v3.12-rc3, v3.12-rc2, v3.12-rc1, v3.11, v3.11-rc7, v3.11-rc6, v3.11-rc5, v3.11-rc4, v3.11-rc3, v3.11-rc2, v3.11-rc1 |
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#
4e5e4705 |
| 03-Jul-2013 |
Eduardo Valentin <eduardo.valentin@ti.com> |
thermal: introduce device tree parser
This patch introduces a device tree bindings for describing the hardware thermal behavior and limits. Also a parser to read and interpret the data and feed it i
thermal: introduce device tree parser
This patch introduces a device tree bindings for describing the hardware thermal behavior and limits. Also a parser to read and interpret the data and feed it in the thermal framework is presented.
This patch introduces a thermal data parser for device tree. The parsed data is used to build thermal zones and thermal binding parameters. The output data can then be used to deploy thermal policies.
This patch adds also documentation regarding this API and how to define tree nodes to use this infrastructure.
Note that, in order to be able to have control on the sensor registration on the DT thermal zone, it was required to allow changing the thermal zone .get_temp callback. For this reason, this patch also removes the 'const' modifier from the .ops field of thermal zone devices.
Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Mark Rutland <mark.rutland@arm.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
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