Searched hist:"8747 f363" (Results 1 – 2 of 2) sorted by relevance
| /openbmc/linux/arch/powerpc/platforms/powernv/ |
| H A D | Makefile | 8747f363 Thu Jun 20 00:21:06 CDT 2013 Gavin Shan <shangw@linux.vnet.ibm.com> powerpc/eeh: EEH backend for P7IOC
For EEH on PowerNV platform, the overall architecture is different
from that on pSeries platform. In order to support multiple I/O chips
in future, we split EEH to 3 layers for PowerNV platform: EEH core,
platform layer, I/O layer. It would give EEH implementation on PowerNV
platform much more flexibility in future.
The patch adds the EEH backend for P7IOC.
Signed-off-by: Gavin Shan <shangw@linux.vnet.ibm.com>
Signed-off-by: Benjamin Herrenschmidt <benh@kernel.crashing.org>
8747f363 Thu Jun 20 00:21:06 CDT 2013 Gavin Shan <shangw@linux.vnet.ibm.com> powerpc/eeh: EEH backend for P7IOC
For EEH on PowerNV platform, the overall architecture is different
from that on pSeries platform. In order to support multiple I/O chips
in future, we split EEH to 3 layers for PowerNV platform: EEH core,
platform layer, I/O layer. It would give EEH implementation on PowerNV
platform much more flexibility in future.
The patch adds the EEH backend for P7IOC.
Signed-off-by: Gavin Shan <shangw@linux.vnet.ibm.com>
Signed-off-by: Benjamin Herrenschmidt <benh@kernel.crashing.org>
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| H A D | pci.h | 8747f363 Thu Jun 20 00:21:06 CDT 2013 Gavin Shan <shangw@linux.vnet.ibm.com> powerpc/eeh: EEH backend for P7IOC
For EEH on PowerNV platform, the overall architecture is different
from that on pSeries platform. In order to support multiple I/O chips
in future, we split EEH to 3 layers for PowerNV platform: EEH core,
platform layer, I/O layer. It would give EEH implementation on PowerNV
platform much more flexibility in future.
The patch adds the EEH backend for P7IOC.
Signed-off-by: Gavin Shan <shangw@linux.vnet.ibm.com>
Signed-off-by: Benjamin Herrenschmidt <benh@kernel.crashing.org>
8747f363 Thu Jun 20 00:21:06 CDT 2013 Gavin Shan <shangw@linux.vnet.ibm.com> powerpc/eeh: EEH backend for P7IOC
For EEH on PowerNV platform, the overall architecture is different
from that on pSeries platform. In order to support multiple I/O chips
in future, we split EEH to 3 layers for PowerNV platform: EEH core,
platform layer, I/O layer. It would give EEH implementation on PowerNV
platform much more flexibility in future.
The patch adds the EEH backend for P7IOC.
Signed-off-by: Gavin Shan <shangw@linux.vnet.ibm.com>
Signed-off-by: Benjamin Herrenschmidt <benh@kernel.crashing.org>
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